Industry News: rf applications (Page 10 of 32)

Vishay Siliconix New 150-mA LDO Regulators in Small SC-70 Package

Industry News | 2005-08-03 13:41:41.0

Combining Low 130-mV Dropout with High 150-mA Current

Vishay Intertechnology, Inc.

Preview for Pickering Interfaces for EDI CON USA – Boston, MA

Industry News | 2016-08-08 07:51:43.0

Pickering Interfaces will showcase their broad range of PXI and LXI RF & Microwave switching solutions, along with their soon-to-be-released 2-slot USB/LXI Modular Chassis and LXI Simulation Tool at EDI CON USA 2016 in booth 822 on September 20-22, 2016.

Pickering Interfaces Ltd.

MicroFab Acquired by Naprotek, a Portfolio Company of Edgewater Capital Partners

Industry News | 2022-08-14 14:24:27.0

Naprotek, LLC. has completed the acquisition of MicroFab, Inc., a privately held company in Manchester, New Hampshire. This acquisition is a strategic element of Naprotek's continued expansion in RF products, services, and solutions. Naprotek now offers customers an array of custom build-to-print thin film products, supported by enhanced capabilities and a wider spectrum of thin film technologies. The business and entire MicroFab team will be integrated into the East Coast operations at SemiGen, a Naprotek Company.

Naprotek, Inc

GAO Introduces Innovative and Cost-Effective Active Beaconing RFID Tag

Industry News | 2008-09-09 02:24:42.0

GAO Introduces Innovative and Cost-Effective Active Beaconing RFID Tag

GAO RFID Inc

Comet Group Receives 2018 Publisher’s Choice Award for Test Services at Lab One

Industry News | 2018-10-17 19:13:45.0

Comet Group has been recognized with a 2018 Publisher’s Choice Award from Global SMT & Packaging magazine for its new Lab One technology and applications center in Silicon Valley. The award was presented to the company on Tuesday, October 16, 2018 in ceremony during SMTA International.

COMET Plasma Control Technologies

Pickering Electronics with latest Reed Relays at electronica 2014, Munich, November 11th to 14th, Booth # A1.530

Industry News | 2014-09-17 13:05:39.0

Pickering Electronics are Manufacturers of high quality Reed Relays for Instrumentation and Automatic Test Equipment (ATE), High voltage switching, Low thermal EMF, Direct drive from CMOS, RF switching and other specialist applications. Relays are available in Surface Mount, Single-in-Line (SIL), Dual-in-Line (DIL) and many other popular package styles.

Pickering Electronics

Pickering Electronics with latest Reed Relays at electronica 2014, Munich, November 11th to 14th, Booth # A1.530 Emphasis on Former-less-Coil Winding -

Industry News | 2014-09-18 17:33:50.0

Pickering Electronics are Manufacturers of high quality Reed Relays for Instrumentation and Automatic Test Equipment (ATE), High voltage switching, Low thermal EMF, Direct drive from CMOS, RF switching and other specialist applications. Relays are available in Surface Mount, Single-in-Line (SIL), Dual-in-Line (DIL) and many other popular package styles.

Pickering Electronics

Pickering Electronics with latest Reed Relays at Designcon USA 2015 Santa Clara Convention Center, January 28-29th, 2015 Booth # 529

Industry News | 2014-12-01 18:01:04.0

Pickering Electronics are Manufacturers of high quality Reed Relays for Instrumentation and Automatic Test Equipment (ATE), High voltage switching, Low thermal EMF, Direct drive from CMOS, RF switching and other specialist applications. Relays are available in Surface Mount, Single-in-Line (SIL), Dual-in-Line (DIL) and many other popular package styles.

Pickering Electronics

High Voltage Reed Relays with interesting packing possibilities to be showcased at Semicon West

Industry News | 2016-06-27 13:38:42.0

Pickering Electronics' newly released Series 67 and 68 Reed Relay range are available for up to 10kV stand-off, 7.5kV switching, with an option of either PCB or flying lead switch connections.

Pickering Electronics

TopLine Sponsors IMAPS Wire Bonding Conference

Industry News | 2018-03-13 18:47:01.0

TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.

TopLine Dummy Components


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