Electronics Forum | Thu Jan 08 16:43:43 EST 2004 | Dean
Unless your machine (internal) thermocouples are each calibrated and compensated no two machines will deliver eactly the same results. Here are your challenges: 1. Data acquisition equipment A-D converter errors 2. PCB measurement thermocouple (t
Electronics Forum | Wed Mar 31 21:08:34 EST 2004 | Ed
Hey guys. I've been manually dunking circuit boards for 8 years now. I too have the excess residue issue to contend with. I'm using a low solids - no clean flux from Kester (959). I have used solvents, thinners, windex and a multititude of cleane
Electronics Forum | Mon Jul 10 11:38:15 EDT 2006 | Rob
Hi Dougs, I think I'm going to have to admit to some insider knowledge here. It kind of gave it away when you mentioned there were only catalogue pages instead of specs. http://www.anglia.com/product_search/part_tracker/index.asp I think you may
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
Electronics Forum | Thu Jan 11 16:01:52 EST 2007 | russ
You using lead free BGAS now? What is your rework equipment and process? I am sure we can help you out here with some more detail, you should get the package data sheets for your problem BGAs and determine ball alloy or they may even be CCGA packag
Electronics Forum | Sun Jan 14 12:48:53 EST 2007 | SMTRework
Also, I was beginning to think that the humidity level in the facility was a factor.. but I don't believe that's the case.. as this condition seems to occur regardless of the humidity level.. Equipment being used is as follows.. Metcal BGA 3500
Electronics Forum | Sun Jan 14 12:42:35 EST 2007 | SMTRework
I think the main cause of this condition is #3 because both #1 and #2 never change from board to board, these are identical boards with identical BGA revisions. These BGA's (as stated before) are about 3 years old.. I don't believe they are lead free
Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F
MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a
