Electronics Forum | Mon Dec 19 07:29:30 EST 2005 | jax
Tg is just a way to say when the board goes limp... or a quick way to rank laminates... who cares. For lead free you want to look at Td, Decomposition Temperatures. ( Temp at which the material weight changes by 5% )
Electronics Forum | Fri Oct 27 11:17:41 EDT 2006 | MFG CAVEMAN
Since I didn't see it mentioned - Are you specifying a laminate that is considered compatible with a RoHS process? I don't mean just a high Tg but a high Td (decomposition) and CTE material such as Isola 410, FR408 etc.
Electronics Forum | Fri Oct 23 07:55:25 EDT 2009 | davef
For a properties comparison, look here: http://www.merix.com/files/Preferred%20Laminates%20and%20Prepreg%20rev%20090106.pdf
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Mon Apr 25 22:56:44 EDT 2005 | davef
rush316 First, no one stated that PBB and/or PCBE are in FR4. FR4 contain tetra-bromo-bisphenol A [TBBA]. Second, there are classes [and grades] of dielectric materials used in fabricating printed circuit boards. Grades, NEMA LI-1. From these gr
Electronics Forum | Wed Nov 28 22:33:24 EST 2007 | davef
There is no specification for lead-free HASL. You can use any lead-free solderability protection that meets your customer requirements. Use IPC-9701 �Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments� to ass
Electronics Forum | Wed Oct 29 06:17:45 EDT 2014 | julianf
As stated in the title I would like to know the thermo-elastic material properties, most preferably the E-modulus and CTE in x- and y-direction, for Epoxy/E-glass laminates and/or prepregs for various fibreglass cloth styles. Datasheets only give ro
Electronics Forum | Wed Aug 15 16:14:22 EDT 2001 | davef
Comparative Tracking Index [CTI]. In printed circuit board fabrication, CTI is a measure of the ability of the laminate surface to withstand tracking [carbonneous tracks on the surface, under wet contaminated conditions] across two electrodes placed
Electronics Forum | Wed Jun 21 20:41:26 EDT 2000 | Dave F
Gary: Regular FR-4 will HASS. HASS has largely fallen from favor, because: * Process is difficult to control, so not to strip the life from components * Failures under HASS have nothing to do in use failures. If you insist on continuing with this,
Electronics Forum | Tue Feb 12 10:33:45 EST 2002 | davef
IPC-4101 - Specification For Base Materials For Rigid And Multilayer Boards replaces MIL-P-13949 - Plastic Sheet, Laminated, Copper-Clad (For Printed Wiring) Taking a broader look, there are many �Obsolete MIL Document To Commercial Document� replac
