Electronics Forum: high frequency (Page 10 of 12)

Solder bridging on IC leads

Electronics Forum | Mon Aug 23 14:09:56 EDT 2010 | davef

Similar to Coop's comments, above ... Bridging: * Mis-placement: misplaced components, high placement force mushrooms paste * Too much paste: HASL thickness, lead finish, poor underside support, poor underside wipe frequency, printing with too lar

Stencil cleaners.

Electronics Forum | Mon Jul 24 15:10:37 EDT 2006 | carln

Here are some additional comments that have been posted on the CircuitNet web site: Fist, the answer is the same regardless of the specific paste type, (leaded or non-leaded). High pressure sprays should never be applied to a stencil. Stencils are

Re: Vibration Tester

Electronics Forum | Fri Oct 09 00:13:33 EDT 1998 | Pete Sorenson

| 2 Product reliability testing. Certainly you wouldn't shake your product to be shipped to customers, but running reliabilty tests, including shake and burn-in testing, are a good way to maintain the relaility of your product. We modified paint s

Metal foil is pulling away from the screen.

Electronics Forum | Mon Feb 19 13:04:17 EST 2001 | billschreiber

The ultrasonic frequency used in today�s stencil cleaners is usually a 40 kHz �sweep� frequency (also used on semiconductors and other sensitive cleaning applications). This frequency is not low enough to cause stencil damage (the lower the frequen

Re: Solder Connection Environmental Screening

Electronics Forum | Wed Aug 23 16:18:47 EDT 2000 | Dr. Ning-Cheng Lee

I presume you are referring to vibration test with fixed frequency at room temperature. One procedure describing the detailed profile is in MIL-STD-883E, Method 2005.2 (12/31/96). The approximate profile can be described as 60Hz, 20-70g, and 96 hrs t

Aqueous Board Cleaning

Electronics Forum | Tue May 20 12:35:45 EDT 2003 | Mike Konrad

This probably a reflow issue, not a cleaning issue. Although ultrasonic cleaners are not normally used in post-reflow applications (fear of internal wire bond damage), I have never heard of broken solder joints caused by an ultrasonic cleaning syst

No-Clean flux residue and RF application

Electronics Forum | Tue Aug 30 12:08:09 EDT 2005 | slthomas

The answer for us at my previous employer was water soluble flux. Wash the board, no residue. If you're not set up to wash (needing a washer, DI water source, waste treatment, ventilation, etc.) it can be expensive and space consuming. Do some resea

Contamination

Electronics Forum | Fri Aug 11 16:19:39 EDT 2006 | T. Oaks

Hi, We have a issue with current leakage between pins on an SSOP 28 in a low frequency RF application and there is a suspicion that it is being caused by something in the flux residue. We have had the bad boards analyzed and a 'high' Chloride level w

Flux Designations and Composition

Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD

Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from

SMT Design Issues for 2225 Capacitors in High Power RF

Electronics Forum | Mon Aug 08 16:14:36 EDT 2011 | wmburke

We are building a plasma diagnostic to monitor MHD phenomena in tokamak. As part of the development, we need high-voltage, high-power RF capacitors to tune and match an inductive load. This application is similar to a small induction heater, with t


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