Electronics Forum | Sat Dec 24 19:39:43 EST 2011 | dontfeedphils
I've reflowed many different size BGA's in an effort to better the connection and to help the board pass functional test. Using a middle of the road liquid flux and a convection spot rework machine and almost every time I would reflow a failed board
Electronics Forum | Tue Jun 18 03:16:46 EDT 2013 | mun4o
production lot is 4000pcs.About 70% of capacitors are out of tolerance ( +/-20%).There are 3pcs C=10u per PCB, in different location.Samsung capacitors wich we use are 1,5 years old - i checked this information from our supplier " Rutronik ".I have
Electronics Forum | Tue Jan 29 20:33:52 EST 2019 | deanm
First, you cannot measure capacitors once they are soldered onto the board. Second, why must you measure? Verify your machine set up by using intelligent feeders (if your machine has them) or a checklist, preferably by two people. If you cannot trus
Electronics Forum | Wed Jan 07 00:18:14 EST 2009 | milanrit
Recently on one of my assemblies(sn/pb) I started seeing leaded BGA failure at functinal test for opens, but when I inspected them through 5DX and ERSA Scope it doesnt seem like there is any opens or insufficient and half no. of boards passed functio
Electronics Forum | Mon Mar 12 08:24:30 EDT 2007 | rgduval
ICT is generally a manufacturing verification test. Coverages vary depending on the board. I've run lots with as low as 25% coverage on the board (but produced 98% FPY post board assembly). Functional test is exactly what it sounds like. Checking
Electronics Forum | Thu Jul 01 00:51:56 EDT 1999 | Scott Cook
| Steve, | | First of all I don't disagree with you, but 104 caps perform a power smoothing function not a data signal function. | | A PCB will still function despite a few dead cap locations. | | It won't function without certain IC lead contact
Electronics Forum | Tue Nov 04 10:21:40 EST 2003 | blnorman
One of the requirements for our components and PCBs is fluid compatibility. They are tested by a 30 second immersion in the applicable solvent/cleaner/fluid, then they are tested for functionality and degradation.
Electronics Forum | Wed May 30 15:15:03 EDT 2001 | Jesse Katzman
Hello, I'm the director of publications for the SMTA, and we're testing the distributed content technology developed by SMTnet. I'm primarily testing the function of posting a new message, thus creating an entirely new thread, but would welcome inpu
Electronics Forum | Wed May 30 17:21:25 EDT 2007 | troyboesch
Pretty much everybody does functional or system test at the end of a printed board assembly line. In-circuit or MDA test hits most complex boards. But, 3D xray is being pushed by Agilent, Teradyne, and TRI. No fixtures and a high call rate for sol
Electronics Forum | Fri Feb 19 02:11:11 EST 1999 | Pete Sorenson
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
