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New Equipment | Industrial Automation
Siemens 6NG4212-8PA01-1AD0 Siemens 6NG4212-8PA01-1AD0 Siemens 6NG4212-8PA01-1AD0 e: sales7@cambia.cn | w: +86 18030273592 s: live:sales 7_1232 DAILY RECOMMENDATION HONEYWELL CC-PFB401 CCPFB401 DISCONTINUED BY MANUFACTURER PART SURPLUS 1
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New Equipment | Industrial Automation
Siemens 6NG4212-8PA01-1BB5 Siemens 6NG4212-8PA01-1BB5 Siemens 6NG4212-8PA01-1BB5 e: sales7@cambia.cn | w: +86 18030273592 s: live:sales 7_1232 DAILY RECOMMENDATION HONEYWELL CC-PFB401 CCPFB401 DISCONTINUED BY MANUFACTURER PART SURPLUS 1
Industry Directory | Manufacturer
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Technical Library | 2019-06-20 00:09:49.0
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni.
Industry News | 2017-07-19 21:09:38.0
STI Electronics is pleased to announce the acquisition of a new Fischerscope X-ray XDAL 237 energy dispersive X-ray fluorescence (EDXRF) system.
New Equipment | Test Equipment
Printed Circuit Boards(PCBs) are used to electrically connect electronic components using conductive pathways, traces, etched from copper sheets laminated onto a non-conductive substrate. Our manufacturing processes utilise the latest techniques an
Ring lug NTC thermistor surface temperature probes are designed for screw-in-place mounting. Most of these temperature probe housings are standard ring terminals or ring lugs with the thermistor potted in the barrel of the lug, popular for temperatur
Our MW Series of ultra soft-fabric wrapped shielding profiles utilises a highly conductive and durable impregnated fabric formed around a sponge or foam core to create a very versatile low compression gasket medium Our MF Series is a range of highl
A spring contact is any part that is used to connect, or keep distance between, two separate parts. These parts can be used to transfer current between the power source and the load on a circuit board. There are a wide variety of applications for suc
CSK Brass Screws Flat Head Screws Brass BRASS CSK SCREWS FLAT HEAD BRASS SLOTTED CSK SCREWS COUNTERSUNK HEAD SCREWS Conex is a leading manufacturer and supplier of BRASS CSK SCREWS COUNTERSUNK HEAD SLOTTED FLAT HEAD BRASS MACHINE SCREWS. W
