Electronics Forum: copper wire bonding (Page 10 of 36)

Etch strain gauge in copper layer to measure deformations during press process [How to?]

Electronics Forum | Sat May 17 10:38:49 EDT 2014 | sarason

I hate to say this but in all probability this wont work. I have built real strain gages and they depend on the change(Co-effiecent) of resistence with strain(or Stretch). since you are connecting you elements up with copper wire it will frm part of

CuPdAu

Electronics Forum | Tue Mar 13 20:47:39 EDT 2018 | davef

I think of palladium coated copper with gold flash (CuPdAu) as bond wire used in chip attach. Look here: https://www.heraeus.com/media/media/het/doc_het/products_and_solutions_het_documents/bonding_wires_documents/fact_sheets/Factsheet_PdFlash.pdf

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F

Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process

PCB pad contamination

Electronics Forum | Mon Aug 27 08:03:32 EDT 2007 | davef

Actually, you will be soldering and wire bonding to the palladium layer, so we should have asked if you checked that layer, rather than the nickel. We not sure of the source of the copper that your see on EDX. It's possible copper from the pad migra

Why gold plating on PCB?

Electronics Forum | Sun Apr 05 00:23:53 EDT 2020 | researchmfg

1. To protect the nickel and copper under gold plating from oxidization before soldering. Gold plating can extend the PCB self-life and improve the solderability for 2nd re-flow. 2. Provide a good bonding strength. For Chip on Board process that Gol

COB Issue's (Non-Sticking)

Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef

Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the

Wire Bonding

Electronics Forum | Wed Mar 25 09:01:09 EST 1998 | Harvey Grossman

What is the recommended finish for wire bonding ? Type of AU, thickness, etc. thanx...

Wire Bonding

Electronics Forum | Sat Jan 21 12:18:53 EST 2006 | theSaint

What is wire bonding? What are the applications?

DCA/Wire Bonding/Encapsulation

Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David

Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?

Wire Bonding

Electronics Forum | Sun Jan 22 09:44:17 EST 2006 | davef

Wire bonding is a die connect methodology that runs either gold or aluminum wires between pads on the integrated circuit to either a lead frame or pads on a printed circuit board. For more look here on Daan Terstegge's excellent link page http://www


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