PCB Libraries, Inc. | https://www.pcblibraries.com/forum/library-expert-2017-19-released_topic2237_post9249.html
: Fixed and issue with footprints with associated copper on slotted holes. This affected all CAD tool translators. POD Builder: Fixed an issue that was creating Handled Exception Errors for certain parts Library Editor
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/library-expert-2017-19-released_topic2237_post9249.html
: Fixed and issue with footprints with associated copper on slotted holes. This affected all CAD tool translators. POD Builder: Fixed an issue that was creating Handled Exception Errors for certain parts Library Editor
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/library-expert-2017-19-released_topic2237.html
: Fixed and issue with footprints with associated copper on slotted holes. This affected all CAD tool translators. POD Builder: Fixed an issue that was creating Handled Exception Errors for certain parts Library Editor
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2237&OB=ASC.html
: Fixed and issue with footprints with associated copper on slotted holes. This affected all CAD tool translators. POD Builder: Fixed an issue that was creating Handled Exception Errors for certain parts Library Editor
| http://etasmt.com/cc?ID=te_news_industry,26961&url=_print
. And our epoxy resin and BT are all organic materials. 2. Inorganic materials: ① Aluminum substrate: The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function
ORION Industries | http://orionindustries.com/pdfs/X300-series.pdf
: White Insulating Layer Finish: Matte or Polish Standard Roll Widths: up to 48” wide Standard Gauges (insulating layer): 0.005”, 0.010”, 0.015”, 0.020”, 0.030” Available Foils: Aluminum, Copper, Tin Plated Copper
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=4
Contact Global HQ Africa Asia Central and South America Europe USA and Canada First Bond Ball/Stud Bump Pull Copper is increasingly replacing gold as the interconnect material for wire bonds, stud
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=9
Contact Global HQ Africa Asia Central and South America Europe USA and Canada First Bond Ball/Stud Bump Pull Copper is increasingly replacing gold as the interconnect material for wire bonds, stud
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=16
Contact Global HQ Africa Asia Central and South America Europe USA and Canada First Bond Ball/Stud Bump Pull Copper is increasingly replacing gold as the interconnect material for wire bonds, stud
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=5
Contact Global HQ Africa Asia Central and South America Europe USA and Canada First Bond Ball/Stud Bump Pull Copper is increasingly replacing gold as the interconnect material for wire bonds, stud
