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New Equipment | Test Equipment
X-6600 X-Ray Images Machine for Semiconductor, Packing components for Semiconductor, Packing components A Leader in the Intelligent x-ray Detection Equipment Application Field LED, SMT, BGA, CSP, Flip Chip Inspection Semiconductor, Packing compon
Strata-Shield ENV� prevents ESD damage of all known categories during transportation and storage: Catastrophic failure Latent failure Mechanical damage Strata-Shield ENV� protects your ESDS in accordance with EN 61340-5-1: Low Charging Dissipative S
Strata-Shield ENV� prevents ESD damage of all known categories during transportation and storage: Catastrophic failure Latent failure Mechanical damage Strata-Shield ENV� protects your ESDS in accordance with EN 61340-5-1: Low Charging Dissipative S
Hand push pcb cutting machine depaneling 330mm length pcba YSV-2M Specification for pcbcuting machine : 1.Easy operating modes 2.Easy setting, edge guiding 3.Cutters re-grinded 4.Avoid micro-cracks v-cut PCB depaneling
Technical Library | 2014-07-10 17:37:18.0
This paper studies and compares the effects of pull–pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package.The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.
PCB Depanelizer Machine -YSVC-1 Specification model YSVC-1 Max cutting length 330mm cutting thickness 1.0-3.5mm Power supply 110/220 cutting speed 0-400 Machine size 420*280*400mm Weight 45kg &nb
This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control
The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the
Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe
New Equipment | Board Handling - Storage
Effective moisture damage solution that improves yields. http://eurekadrytech.com/fast-super-dryer/tus-101 Capacity: 93 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing door for 30 seconds or les
