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IPC-A-610 Certified IPC Trainer (CIT) Course

Training Courses | | | IPC-A-610 Trainer (CIT)

The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.

Circuit Technology Inc.

IPC-A-610 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-A-610 Trainer (CIT)

The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.

Verion Training Systems, LLC

IPC-A-610 Trainer (CIT) Recertification Course

Training Courses | | | IPC-A-610 Trainer (CIT) Recert.

The Certified IPC-A-610 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-A-610 Specialist (CIS) training.

Verion Training Systems, LLC

Solder Paste Stencil Design for Optimal QFN Yield and Reliability

Technical Library | 2015-06-11 21:20:29.0

The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements

Lockheed Martin Corporation

Everything You Need to Know About X-Rays

Events Calendar | Wed Jun 20 00:00:00 EDT 2018 - Wed Jun 20 00:00:00 EDT 2018 | ,

Everything You Need to Know About X-Rays

Creative Electron Inc

Don't Miss KYZEN’s QFN Design Considerations to Improve Cleaning during SMTAI

Industry News | 2014-09-19 20:19:38.0

KYZEN is pleased to announce that Dr. Mike Bixenman will present the paper titled “QFN Design Considerations to Improve Cleaning – A Follow on Study” at the upcoming SMTA International exhibition.

KYZEN Corporation

Cleaning Flux Residue under Leadless Components using Objective Evidence to Determine Cleaning Performance

Technical Library | 2019-08-14 22:20:55.0

Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.

KYZEN Corporation

KYZEN’s Dr. Mike to Present No-Clean Flux Residue Study Findings at SMTAI

Industry News | 2016-09-07 18:44:03.0

KYZEN announces that Dr. Mike Bixenman will present the recent paper entitled, “Reactivity of No-Clean Flux Residues Trapped Under Bottom Terminated Components” during SMTA International. The paper is co-authored by Bruno Tolla, Ph.D., Jennifer Allen and Kyle Loomis from Kester and will be presented during the “Flux, Solder, Adhesives Track” on Tuesday, September 27, 2016 at 3 p.m.

KYZEN Corporation

TR7500 SIII CI Conformal Coating Inspection Solution

TR7500 SIII CI Conformal Coating Inspection Solution

New Equipment | Inspection

TR7500 SIII CI brings easy Conformal Coating Inspection that combines a multi-camera optical design with specialized multi-phase lighting to inspect UV-active Conformal Coatings. Included angle view cameras ensure the TR7500 SIII CI identifies even t

TRI - Test Research, Inc. USA

MPM / Speedline Green Monster Understencil Wiping Rolls

MPM / Speedline Green Monster Understencil Wiping Rolls

New Equipment | Solder Paste Stencils

Our MPM / Speedline Green Monster Understencil Wiping Rolls are comprised of coarse rayon and ESD polyester bonded by a tough proprietary formula of copolymers to make a fabric of high integrity ESD GREEN MONSTER!™ is the only stencil wiping roll t

Blue Thunder Technologies, Inc.


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