Electronics Forum | Wed Jun 27 21:33:09 EDT 2001 | davef
There was a similar thread last week on SMTnet. Maybe the poster of that thread can help. Not everyone responds on-line. Check the SMTnet Archives for generalities and platitudes about PIH, although there may be some good links. Baring the obviou
Electronics Forum | Thu Apr 01 16:47:23 EST 1999 | AlexO
Dan, The rationale to use laser cut stencils in my experience is based on the benefits to paste release. Laser cut stencils are "supposed" to have a smoother inner aperture wall. That, combined with the trapezoidal shape (which can be emulated with
Electronics Forum | Fri May 07 18:01:11 EDT 1999 | Bill Schreiber
Just a note about cleaning SMD adhesives. Cleaning does not need to be hazardous. Smart Sonic has a non hazardous process that has been used for over 9 years using a non hazardous detergent that has been certified by the AQMD as a clean air chemist
Electronics Forum | Fri May 07 18:02:37 EDT 1999 | Bill Schreiber
Just a note about cleaning SMD adhesives. Cleaning does not need to be hazardous. Smart Sonic has a non hazardous process that has been used for over 9 years using a non hazardous detergent that has been certified by the AQMD as a clean air chemist
Electronics Forum | Mon Nov 16 12:41:46 EST 1998 | MMurphy
| | | | | I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | | | | | | | | | Fraser- | | | | | | | | We use polyimide stencils with great success for our prototype boards. They are
Electronics Forum | Tue Sep 21 17:24:58 EDT 1999 | John Thorup
| | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | thanks | | | | | | | We use 6 mil lasercu
Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F
Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan
Electronics Forum | Thu Dec 16 06:59:43 EST 1999 | Christopher Lampron
Calvin, We have found several reasons for solder beading occurance. We have found that solder balling is usually directly attributed to the reflow profile while solder beading is usually (but not always) a result of either excessive solder paste volu
Electronics Forum | Wed Feb 04 10:01:55 EST 2009 | dcell_1t
Hi there, We're developing a DOE where stencil design (aperture design) is going to be evaluated, currently we have regular reduction on sides, home base (triangular and semi-circle), "C" or "U" shape, and an idea for oval shape for pasives also cam
Electronics Forum | Sun Sep 11 05:48:32 EDT 2005 | Mika
If 0 or 180 degr. make v-shape openings to each other left & riht, if 90 or 270 degr. top/ bottom, on the stencil apertures; well, you understand... We use this and 87 % reduction of stencil apertures for 0603:s and 0402:s. 0.127 mm stencil thicknes
