Industry News | 2022-03-28 21:03:04.0
Pulsar solderability test system determines how well molten solder will wet on solderable surfaces of electronic components.
Industry News | 2022-05-03 21:48:33.0
Solderability testing determines the solderability of electronic component terminations by providing the degree of wetting necessary to form robust solder interconnections.
Industry News | 2010-03-24 12:57:09.0
GREELEY, CO — FCT Assembly to highlight its range of new solder pastes in booth 2317 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2015-08-25 11:15:00.0
Techcon Systems has developed a new disposable material path (DMP) diaphragm valve. The new TS5624DMP valve features a “first to market” disposable material path, enabling difficult fluids and pre-mixed two-part epoxies to be dispensed without the need for frequent cleaning. The entire wetted area can simply be replaced in a matter of seconds, while the valve stays on the production line.
Industry News | 2008-03-01 19:33:42.0
Nihon Superior�s unique SnCuNiGe solder, SN100C�, that has established itself as the best alloy for lead-free wave soldering, will now be available as a high-performance solder paste with a general purpose �P500� flux medium.
Industry News | 2012-11-20 16:01:29.0
M.E. Baker Company announces that it has appointed Troy Vittum as its newest Program Engineer.
Industry News | 2013-01-02 16:21:23.0
Baker Solar,announces that its new Web site is now available. The new site, located at www.bakersolarinc.com, is an informative, user-friendly resource for current and prospective customers.
Industry News | 2016-03-22 16:57:05.0
Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.
Industry News | 2016-03-23 20:19:20.0
Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.
Industry News | 2017-01-05 04:27:37.0
BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:
