Electronics Forum | Thu Mar 27 11:39:27 EST 2003 | kenlchin
Hi,mantis, I has experienced this case.when we run a model ,misalignment and tombstone of some 0805 resistors and 1206 caps always occured.we have taken many actions,such as adjusting reflow parameter&printing parameter,checking pcb and parts soldera
Electronics Forum | Thu Nov 30 12:12:14 EST 2006 | pbarton
I am in the process of characterising a new vapour phase reflow system and am interested to learn if anyone out there has ever come across time/temperature datalogging equipment capable of being run through the entire process (including vacuum) along
Electronics Forum | Fri Feb 16 06:47:38 EST 2007 | CL
vshan, We were using pallets (delmat with cavities for the flex) We put stips of double sided Kapton tape in the critical areas. The tape held up to the heat and kept the circuit flat for the QFP's and BGA's. We based our assembly process for this c
Electronics Forum | Thu Jan 31 09:37:03 EST 2008 | jola
Hello. We have currently a big problem with our Reflow owens getting very dirty very fast. It's like a thick layer of "dust" on all parts in the preheat and the beginning of the cooling zoon. We dont have that all the time and it's seems to be from b
Electronics Forum | Wed Aug 01 15:18:40 EDT 2018 | dleeper
One option might be to convert the coil to through hole and use intrusive reflow AKA pin in paste. the coil leads would have to be formed perpendicular to the board instead of parallel. you would have through holes instead of SMT pads, but you would
Electronics Forum | Thu Aug 19 22:59:48 EDT 1999 | Jeff Ferry
| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad
Electronics Forum | Thu Aug 19 23:56:49 EDT 1999 | Earl Moon
| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the
Electronics Forum | Fri Aug 20 09:33:51 EDT 1999 | Don Morgenstern
Earl & Jeff Our machine is different than the Electrovert Solder Pak in that it is does not behave like a "volcano". Jeff, please contact me if you have safety concerns as perhaps you also want to consider our equipment. | | I'm trying a second ti
Electronics Forum | Wed May 16 13:06:33 EDT 2007 | stepheniii
3.3.2.1 Moisture Barrier Bag (MBB) The moisture barrier bag shall meet MIL-PRF-81705, TYPE I requirements for flexibility, ESD protection, mechanical strength, and puncture resistance. The bags shall be heat sealable. The Water Vapor Transmission Rat
Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef
Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s
