Full Site - : thermal cycles (Page 9 of 120)

Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints

Technical Library | 2012-09-13 20:45:17.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor

Agilent Technologies, Inc.

Soletech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Manufacturer's Representative / Other

Semiconductor and SMT equipments sales new and used. Includes FA lab equipment Test, FIB, SEM, EDX,, C-SAM, inspection and probers

GF-C2-HT Reflow Ovens

GF-C2-HT Reflow Ovens

New Equipment | Reflow

This small reflow oven provides a versatile heating system for lead-free preheating, curing, reflow, rework, and thermal cycling applications in prototype or batch applications. Combination forced air convection/conduction heating system for consiste

DDM Novastar Inc

Underfill Encapsulants for Flip Chips

Underfill Encapsulants for Flip Chips

New Equipment | Materials

Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to

Zymet, Inc

Temperature Humidity Environmental Test Chamber

Temperature Humidity Environmental Test Chamber

New Equipment | Test Equipment

DGBell’s Temperature and Humidity Test Chamber is able to simulate a wide range of temperature and humidity environment condition for testing various products and components. It is widely used for basic thermal cycling test and accelerated stre

Guangdong Bell Experiment Equipment Co.,Ltd

CALCE Reliability Science Symposium - Spring 2020

Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA

CALCE Reliability Science Symposium - Spring 2020

CALCE Center for Advanced Life Cycle Engineering

Used Equipment

New Equipment |  

We have various euipment avilable: Re-flow ovens Tape & Reel Inpsection Test Marking Probers Ovens - Burn-in, Temp Cycle, Thermal Shock, Humidity and temp.

Soletech Corp.

WL 66O Optical Lens Adhesive

WL 66O Optical Lens Adhesive

New Equipment | Materials

WL 66O is one part 100% solid, dual cure UV bonding adhesives, which has been designed for wafer-level lens or optical lens attachment. It can be cured by UV in a few seconds to achieve fast fixing purpose, then further cured by thermal cure to achie

YINCAE Advanced Materials, LLC.

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

New Equipment | Assembly Services

TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left

Toddco3


thermal cycles searches for Companies, Equipment, Machines, Suppliers & Information