Industry News | 2011-04-18 11:59:48.0
PROMATION's new soldering robot a hit at IPC/APEX show in Las Vegas.
Industry News | 2010-02-23 16:29:14.0
The Center of Advanced Life Cycle Engineering at the University of Maryland in collaboration with The Institute of Scientific and Industrial Research (ISIR) at Osaka University is pleased to announce the call for participation for the Fourth International Symposium on Tin Whiskers.
Industry News | 2024-01-29 11:33:44.0
Indium Corporation® is proud to showcase its proven advanced assembly materials for power electronics, including the rapidly evolving electric vehicle (EV) manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan. Indium Corporation's products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.
Industry News | 2001-12-12 07:21:44.0
AIM, Inc. and Nihon Almit Co., Ltd. today announced the signing of a worldwide license agreement for AIM's patented lead-free alloy, trade-named CASTIN®. The agreement enables Nihon Almit to manufacture and sell the alloy throughout the world.
Industry News | 2010-12-07 15:12:39.0
Krayden, Inc., a leading distributor of engineered materials, introduces the Sylgard 160 elastomer by Dow Corning, a gray two-part silicone, flowable liquid.
Industry News | 2011-05-19 21:01:56.0
Christopher Associates Inc. today introduced two new solder pastes formulated for use in LED manufacturing.
Industry News | 2011-07-18 12:51:32.0
Krayden introduces Dow Corning’s PV-804 Sealant ideal for room-temperature curing.
Industry News | 2011-08-29 16:29:56.0
Engineered Conductive Materials debuts its DB-1580 Series Conductive Stringer Attach Adhesives for back contact applications in crystalline silicon solar modules.
Industry News | 2011-11-08 13:28:32.0
Engineered Conductive Materials introduces its DB-1588 low-cost conductive adhesive for back contact applications in crystalline silicon solar modules.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
