Electronics Forum | Thu Aug 13 03:10:22 EDT 1998 | Terry Keen
| Couple of questions. | 1) Are we talking alumina substrates as the ceramic material? | 2) Are we co-firing gold as the conductors on the substrate surface? | 3) In other words, is this a hybrid thick film circuit? | 4) If so, how large or small? S
Electronics Forum | Wed Mar 25 13:29:08 EST 1998 | Gary Simbulan
We currently use an abrasive fiberglass brush to clean the silver oxide off of our substrates proir to asembly. It's messy and tiring. Is there an alternative method, either chemical or mechanical that is cost effective for small (30 to 50ea 6in sq
Electronics Forum | Wed Sep 19 13:43:49 EDT 2001 | jschake
I cannot report having experience with 0201 printing applications on flex circuits. Generally, I would be concerned with handling of the flex substrate. A carefully designed vacuum capable custom tooling fixture would likely be required to ensure p
Electronics Forum | Thu Jan 18 08:37:10 EST 2007 | CL,
"solder tends to pool on the short side of the substrate" Does the short side of the substrate have any significant difference in thermal mass? if so, try slowing the belt (within reason) or increasing temps (within reason) to better equalize therma
Electronics Forum | Thu Feb 15 10:40:27 EST 2007 | phil69
Hi All, I was wondering if anyone has experience of printing solder paste on to 2x2" ceramic substrates.. At present we are using a very old de haart printer with a mesh emulsion screen.. I am looking to replace this with a more reliable mo
Electronics Forum | Wed Dec 14 12:34:56 EST 2016 | cy4223111
Hi all, Recently, we are trying to do wire bonding between a 75 * 75 um pad on a chip and substrate with 150 um height difference, but when completing wire bonding and the wire bonds on pad and substrate, the pad will get out of the chip easily
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
Electronics Forum | Tue Jan 30 21:15:51 EST 2001 | davef
You seem to pretty far from shore to begin thinking about boats and floatation devices. Most laser trimmers are used by: * Semiconductor fabricators * Resistive component fabricators * Hybrid circuit assemblers Component fabricators and hybrid [
Electronics Forum | Thu Sep 10 09:47:15 EDT 1998 | Earl Moon
| hi, | 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. | We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of e
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
