Industry News | 2012-09-18 14:01:32.0
AIMwill present a paper titled “VOC-free Flux Study: Not All Weak Organic Acids Are the Same” at the upcoming PCB West Conference & Exhibition
Industry News | 2014-08-27 23:28:36.0
Indium Corporation's Karthik Vijay will present The Effect of Reflow Profiling on the Electrical Reliablity of No-Clean Solder Paste Flux Residues at the SMART Group's seminar, Reliability and Standards in Real Life: An IPC and SMART Group Perspective.
Industry News | 2017-02-28 12:28:23.0
Kester was awarded Circuit Assembly’s 2017 New Product Introduction (NPI) Award in the category of Flux for SELECT-10™ Selective Solder Flux. The award was presented during the IPC APEX EXPO 2017.
Industry News | 2012-05-21 13:23:06.0
NC275LR is really leading-edge technology for VOC-free fluxes.
Industry News | 2018-10-11 19:44:24.0
KYZEN today announced that Mike Bixenman, DBA, will present three papers during the technical sessions at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2022-09-26 07:17:35.0
Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, received a 2022 Mexico Technology Award in the category of Test Equipment for its AutoCAF2+ and CLRHV Bridge. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.
Industry News | 2021-02-18 10:41:08.0
The Murray Percival Company today announced they will be hosting a FREE webinar in partnership with Magnalytix on March 4, 2021, from 1-1:45 p.m. Eastern time.
Industry News | 2012-11-22 03:27:45.0
The clinic is organized by IPC and National Physical Laboratory
Technical Library | 2016-07-28 17:00:20.0
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.
Industry News | 2015-12-10 01:13:20.0
We are very pleased to help organise the NPL monthly webinars which are free to join and provide support to the industry world wide
