YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA 6/20/2023 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative
YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA 6/20/2023 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative
6/20/2023 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative underfill material is specifically designed to provide a fast flow, lower-temperature cure for high-
Industry News | 2022-09-15 06:27:38.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present the technical paper: "Edge Bonding as Viable Reinforcement For Solder Joints in High Reliability Applications" at the SMTA Penang Chapter Expo & Technical Forum 2022 taking place from September 21 - 22 in Penang, Malaysia.
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process
New Equipment | Cleaning Agents
KYZEN E5611 is a concentrated aqueous cleaning chemistry designed to remove non-reflowed solder paste and uncured chip bonder adhesives from stencils and hardware following the printing process. E5611 works on a wide range of solder paste technologie
Technical Library | 2014-05-12 09:24:11.0
With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
New Equipment | Cleaning Equipment
SMT PCB Cleaner UC-250M-CV PCB size 50﹡50~330﹡250 mm Adhesive roll 2 rolls Width adjustment Manual Weight About 120 kg Product description: SMT PCB Cleaner UC-250M-CV， PCB size 50﹡50~330﹡250 mm, Adhesive roll 2 rolls, Adhesive roll 2 rolls, We
