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Notices in the use of temperature and humidity Test Chamber

Technical Library | 2019-05-06 23:04:05.0

The temperature and humidity test chamber simulate the temperature and humidity, so there are a lot of things customers shoud notice in the process of use, although there is detailed instruction when purchasing the equipment. But some users just know how the device works and start using it. This is very easy to cause problems in the use of the equipment, so Symor intends to describe the safety details during the use of temperature and humidity chamber. 1. Before the test, determine if the sample contains flammable and explosive substances to avoid combustion or explosion during the test. Of course, also make sure there is no flammable and explosive material around the test equipment, otherwise it may cause fire and other accidents. 2, Do not open the chamber door to operate during the experiment, or the gas in the studio may cause the operator to burn and so on. 3. At the end of the test or at the time of regular cleaning of the test chamber, power off the equipment to avoid electrocution accidents. Also, when cutting off the equipment power, pull the power cord to pull out the plug, otherwise it may lead to a rupture of the power cord and so on. You can contact manufacturers if there are some places you donnot understand, do not dismantle and repair the temperature and humidity test chamber without authorization, otherwise it may lead to more serious problems.

Symor Instrument Equipment Co.,Ltd

Nordson DAGE Wins A 2011 Global Technology Award for its 4000Plus Bondtester Pad Cratering Inspection System

Industry News | 2011-11-20 13:14:27.0

Nordson DAGE has been awarded a Global Technology Award in the category of Test Equipment for its 4000Plus Bondtester Pad Cratering Inspection System.

Nordson DAGE

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

New Equipment | IC Packaging

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia

Hesse Mechatronics

Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at ISTFA 2011

Industry News | 2011-10-16 00:05:15.0

Nordson DAGE will highlight its latest bond testing and X-ray inspection capabilities in Booth #326 at the upcoming International Symposium for Testing and Failure Analysis (ISTFA).

Nordson DAGE

Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at IMAPS 2011

Industry News | 2011-09-12 11:53:55.0

Nordson DAGE will highlight its latest bond testing and X-ray inspection capabilities in Booth #512 at the upcoming IMAPS 44th International Symposium on Microelectronics.

Nordson DAGE

Nordson DAGE to Exhibit Bond Test and X-Ray Solutions at SEMICON West 2012

Industry News | 2012-06-11 12:36:11.0

Nordson DAGE, announces it will exhibit in Booth #5971 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.

Nordson DAGE

Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica

Industry News | 2013-10-31 11:53:09.0

Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

Hesse Mechatronics

Precision Valve & Automation (PVA) Precision Valve and Automation SCS-4393 Photo Resist Spray Coater

Precision Valve & Automation (PVA) Precision Valve and Automation SCS-4393 Photo Resist Spray Coater

Used SMT Equipment | Coating and Encapsulation

Precision Valve and Automation SCS-4393 Photo Resist Spray Coater This *coater* appears to be in decent cosmetic condition, considering the process it performs.  There are some signs of wear. Supposedly working when pulled from service, we

karenmadison.com

Nordson DAGE to Bring Solutions for Live Imaging and Demanding Applications to SMT/Hybrid/Packaging

Industry News | 2013-03-20 10:54:36.0

Nordson DAGE, announces it will exhibit in Booth # 7-224 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

Nordson DAGE

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