New Equipment | Cleaning Agents
AQUANOX A4651US is a low pH cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. A4651US reduces the cavitation threshold, will completely remove flux residues from printed circuit assemblies and is compatible with
New Equipment | Cleaning Agents
IONOX I3302 is a semi-aqueous cleaning agent designed for cleaning the most challenging SMT Pb-free solder paste and tacky flux paste residues. This solution is also safe and effective for use on the newest Sn/Bi solder paste formulas. I3302 is high
New Equipment | Cleaning Agents
CYBERSOLV C8502 is specially formulated to quickly remove all types of flux residues from wave solder fingers, reflow oven surfaces and general electronics production equipment. C8502 is also effective on rosin flux used on fabrication of dissimilar
New Equipment | Cleaning Agents
CYBERSOLV C8882 is a solvent-based stencil cleaning fluid specifically designed to clean solder paste, uncured SMT adhesive and flux residue from stencils, mis-printed PCBs, stencil tools and printing squeegees. C8882 can be used in automated underst
New Equipment | Cleaning Agents
MICRONOX MX2150 is a used as received cleaning agent that is designed to remove flux residues from Camera Module (CMOS, CCD) assemblies. MX2150 is effective on a broad range of Pb-free process flux residues in ultrasonic systems, and preserves shine
Industry News | 2019-05-27 21:25:14.0
SHENMAO America, Inc.’s SM-901 Water-Based Wave Soldering Flux has been designed for use in lead-free and tin-lead wave soldering applications. The company also offers the SMCW Series Water-Based Cleaner, which is ideal for removing flux residues and other smudges.
Industry News | 2017-06-13 20:22:20.0
Today KYZEN announced plans to exhibit at SEMICON West, in booth #6072, taking place July 11-13, 2017 at the Moscone Center in San Francisco, CA. The KYZEN booth will feature MICRONOX® 2707 for Cu pillar flip chip applications.
Industry News | 2018-06-11 19:02:50.0
KYZEN announced plans to exhibit in Booth #5976 at SEMICON West, scheduled to take place July 10-12, 2018 at the Moscone Center in San Francisco, CA. The KYZEN booth will feature MICRONOX® 2707 for Cu pillar flip chip applications.
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
Industry News | 2019-06-11 10:33:49.0
KYZEN announced plans to exhibit at SEMICON West, scheduled to take place July 9-11, 2019 at the Moscone Center in San Francisco, CA. The KYZEN team will offer free cleaning assessments and an inside look at their chemistries, MICRONOX® M2322 and MICRONOX® M2708, in Booth #5369.
