Industry News | 2009-08-10 20:22:02.0
2@+/- 12.5µm and a 7µm Total Thickness Variation (TTV), DirEKt Coat wafer coating processes effectively address the needs of current and future thinned wafer products.
New Equipment | Test Equipment
SAKI 2D AOI BF-Planet-X II Resolution 10μm Board size:330x250mm Dimension:600 × 915 × 1270mm, weight:Approx. 275kg Product description: SAKI 2D AOI BF-Planet-X II Smallest footprint, inline, high speed, Resolution 10μm, Boa
New Equipment | Test Equipment
SAKI 2D AOI BF-Planet-X II Resolution 10μm Board size:330x250mm Dimension:600 × 915 × 1270mm, weight:Approx. 275kg Product description: SAKI 2D AOI BF-Planet-X II Smallest footprint, inline, high speed, Resolution 10μm, Bo
New Equipment | Test Equipment
SAKI AOI BF-Frontier II Resolution 18μm Board size:460×500mm Dimension:850 × 1340 × 1230mm weight:450kg Product description: SAKI AOI BF-Frontier II, Resolution 18μm, Board size:460×500mm, Dimension:850 ×
Industry News | 2009-08-04 16:28:40.0
2 @ +/- 12.5µm and advanced speed and acceleration control to ensure robust processing of today’s delicate wafer products.
Industry News | 2010-03-27 17:37:02.0
TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will feature its leading machinery in booth 407 at the upcoming IPC/APEX conference and exhibition.
Industry News | 2009-08-19 13:06:06.0
Extending its capabilities for placing solder spheres at high speed, DEK’s proven DirEKt Ball Placement™ process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield of over 99.99%, DirEKt Ball Placement delivers the speeds necessary for modern package manufacture without sacrificing anything in the way of performance.
Industry News | 2010-05-04 21:09:23.0
Addressing the challenges posed by traditional greases and phase-change thermal interface materials, Henkel has developed and commercialized Loctite PowerstrateXtreme Printable (PSX-P), a new print-friendly thermal management product.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation