Full Site - : not flat stencil printing (Page 9 of 20)

DEK Raises the Bar on DirEKt Coat™ Technology

Industry News | 2009-08-10 20:22:02.0

2@+/- 12.5µm and a 7µm Total Thickness Variation (TTV), DirEKt Coat wafer coating processes effectively address the needs of current and future thinned wafer products.

ASM Assembly Systems (DEK)

SAKI 2D AOI BF-Planet-X II

SAKI 2D AOI BF-Planet-X II

New Equipment | Test Equipment

SAKI 2D AOI BF-Planet-X II Resolution 10μm Board size:330x250mm Dimension:​600 × 915 × 1270mm, weight:Approx. 275kg Product description: SAKI 2D AOI BF-Planet-X II Smallest footprint, inline, high speed, Resolution 10μm, Boa

Flasonsmt Co.,ltd

SAKI 2D AOI BF-Planet-X II

SAKI 2D AOI BF-Planet-X II

New Equipment | Test Equipment

SAKI 2D AOI BF-Planet-X II Resolution 10μm Board size:330x250mm Dimension:​600 × 915 × 1270mm, weight:Approx. 275kg Product description: SAKI 2D AOI BF-Planet-X II Smallest footprint, inline, high speed, Resolution 10μm, Bo

Flasonsmt Co.,ltd

SAKI AOI BF-Frontier II

SAKI AOI BF-Frontier II

New Equipment | Test Equipment

SAKI AOI BF-Frontier II Resolution 18μm Board size:460×500mm Dimension:​850 × 1340 × 1230mm weight:450kg Product description: SAKI AOI BF-Frontier II, Resolution 18μm, Board size:460×500mm, Dimension:​850 ×

Flasonsmt Co.,ltd

Galaxy Thin Wafer System from DEK Enhances Process Capability for HVM Thinned Wafer Applications

Industry News | 2009-08-04 16:28:40.0

2 @ +/- 12.5µm and advanced speed and acceleration control to ensure robust processing of today’s delicate wafer products.

ASM Assembly Systems (DEK)

Seika Machinery, Inc. to Feature Leading Machinery at APEX 2010

Industry News | 2010-03-27 17:37:02.0

TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will feature its leading machinery in booth 407 at the upcoming IPC/APEX conference and exhibition.

Seika Machinery, Inc.

Basics of Control Impedance

Industry News | 2018-10-18 11:16:22.0

Basics of Control Impedance

Flason Electronic Co.,limited

DEK’s DirEKt Ball Placement Technology Advances toward Microsphere Capability

Industry News | 2009-08-19 13:06:06.0

Extending its capabilities for placing solder spheres at high speed, DEK’s proven DirEKt Ball Placement™ process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield of over 99.99%, DirEKt Ball Placement delivers the speeds necessary for modern package manufacture without sacrificing anything in the way of performance.

ASM Assembly Systems (DEK)

Loctite PowerstrateXtreme Printable from Henkel Raises the Bar on Thermal Management Flexibility

Industry News | 2010-05-04 21:09:23.0

Addressing the challenges posed by traditional greases and phase-change thermal interface materials, Henkel has developed and commercialized Loctite PowerstrateXtreme Printable (PSX-P), a new print-friendly thermal management product.

Henkel Electronic Materials

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited


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