Electronics Forum | Sat Jun 17 08:57:23 EDT 2000 | Chrys Shea
A few more tricks to try: - Got a hot air rework machine? You can get more controlled heat on the area and lower the risk of damage to the fab. I never got topside fillets un unrelieve ground planes until I went to convection preheat on my waves.
Electronics Forum | Thu Sep 13 13:29:06 EDT 2001 | mparker
Dave et al, I just print out and read a copy of the aforementioned recommended article. Mr. Mangin gives a clear picture of why DPMO is to be considered a more pure data than First Pass Yield (FPY). However, I must note that his interpretation of h
Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan
| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil
Electronics Forum | Tue Jan 23 17:48:17 EST 2007 | GS
for SMDs, try to look for EIA-481.1.2.3, or may be the new version EIA-200 if I am not wrong. Also IEC 60286-2 (leaded components like axials, radials,..) Regards......GS
Electronics Forum | Tue May 26 03:33:19 EDT 2009 | kevyeoh
May i know how do we differentiate between Class 1, 2 and 3 components? What are the key differences between those three classes? When i check at IPC document, it is stated that Class 1: General Electric Class 2: Dedicated Service Electronic prod
Electronics Forum | Tue Nov 30 21:23:55 EST 1999 | cklau
hello; When we are doing component land pattern design , one thing will always be in our mind; that is the basic criteria or common land pattern design guideline for reflow and flow solder assemblies. For basic fomula in calculating resistors are:
Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW
| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)
Electronics Forum | Thu Jun 01 22:05:01 EDT 2023 | calebcsmt
For contract manufacturers, Unless expectations/requirements are particularly specified by customers OR there is a discussion and contract in place, what are the expectations when it comes to the assembly standards and practices? Is J-STD essenti
Electronics Forum | Mon Jun 30 08:55:31 EDT 2008 | davef
It will be tough to find a dimensional thickness specification for HASL. IPC-6012 Table 3-2, line "Fused tin-lead or solder coat - Coverage and Solderable" states the requirement that there has to be complete coverage of solder on the land, and it mu
Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef
There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|
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