Electronics Forum | Mon Jun 08 16:20:43 EDT 1998 | Earl Moon
| | How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can
Electronics Forum | Mon Jun 08 12:42:01 EDT 1998 | Earl Moon
| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr
Electronics Forum | Tue Jun 16 15:10:27 EDT 1998 | Bob Willis
Simple x-ray inspection works well have a word with those nice people at Nicolet or Glenbrook. One of them was featured on my x-ray training video for BGA. A procedure for inspection criteria is on my web site if it is of use. | | How do I mechanical
Electronics Forum | Wed Dec 07 13:10:32 EST 2011 | conjugate
Hi Reese, the contamination is coming from the material of the PCB itself. Basically, there`re failure observed in the products from electronics factory. preliminary analysis been done, the main board not properly functioning due to bad solder. next
Electronics Forum | Fri Apr 19 11:10:34 EDT 2002 | Steve Bondarewski
I am part of a software company looking for electronic industry feedback for the perfect FMEA software tool. Understanding how boring FMEA studies can be, how can FMEA software be improved to reduce liability and increase innovation? Basically, I wa
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Mon Jun 08 11:39:28 EDT 1998 | Earl Moon
| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr
Electronics Forum | Thu Aug 27 20:06:25 EDT 1998 | Kallol Chakraborty
Hi folks, Lately I am also having problem with BGA ball problem. We are finding more and more on X-ray analysis and is very expensive to replace. I know for sure that we could rework on CCGA but there is no certified process in industry as we speak
Electronics Forum | Sat Aug 29 09:12:39 EDT 1998 | Dave F
| Hi folks, | Lately I am also having problem with BGA ball problem. | We are finding more and more on X-ray analysis and is very expensive to replace. I know for sure that we could | rework on CCGA but there is no certified process in industry as w
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
