Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Aug 09 15:06:17 EDT 2023 | SMTA-64386426
The first thing I do when looking at a part relative to stencil design, is determine the coplanarity per the data sheet. Ideally your stencil thickness should be equal to, or if needed, greater than the coplanarity. You want the solder paste to com
Electronics Forum | Tue Sep 08 13:12:05 EDT 2020 | spoiltforchoice
> Tombstone is often caused by an imbalance of > temperature, pad shape or spacing, component > termination, and component positioning. Pate > formulation and reflow atmosphere are other > common causes. Looking at the pads and &
Electronics Forum | Fri Oct 12 14:19:03 EDT 2001 | David Brink
Steve Often solder mask is the only solution but in many cases there is enought space between smt and thru-hole to utilize a component masking wave solder pallet. The advantage to a pallet is consistancy of results and excellent protection of masked
Electronics Forum | Wed Jul 26 10:42:43 EDT 2017 | proceng1
We have an array of boards that are difficult to depanel due to components being close to the edge. I want to route a space between strips (boards are 14" long x 1" wide) and have breakaway tabs like mouse bites, but the customer won't accept the ja
Electronics Forum | Fri Oct 29 10:57:45 EDT 1999 | JohnJ
We considered direct marking already John. It's not very practical for us to do that. We need to put labels on components as well as boards. A laser or inkjet would cause us to have to change too many things in our processes. We'd still need to do la
Electronics Forum | Mon Jun 07 22:30:28 EDT 1999 | Dave F
| | | I was wondering what measurements are used to define pitch? | | | | | Frank: John's correct with the most common definition, but there can be others, depending on your perspective. TTYL Dave F | | | | Pitch. The center-to-center spacing b
Electronics Forum | Wed Apr 07 11:53:59 EDT 1999 | Dave F
| Could somebody send me some information about the SMT Beginning? | I mean, when, where, why, SMT starts. | | Thank you, | | Roberto. | Roberto: There�s lots of reasons for getting into SMT. Some of which follow: 1 Manufacturing engineers thi
Electronics Forum | Wed Apr 07 12:54:13 EDT 1999 | Roberto Cardozo
| | Could somebody send me some information about the SMT Beginning? | | I mean, when, where, why, SMT starts. | | | | Thank you, | | | | Roberto. | | | Roberto: There�s lots of reasons for getting into SMT. Some of which follow: | | 1 Manufac
Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
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