Electronics Forum: flux residues (Page 82 of 116)

Re: Adhesion loss on passives over wave

Electronics Forum | Fri Mar 19 13:26:19 EST 1999 | Scott Cook

| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 15:49:05 EDT 1998 | Earl Moon

| | We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg

Re: Environmental Issues

Electronics Forum | Thu May 21 20:06:12 EDT 1998 | Bill Schreiber

| Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recently t

Touch-up and inspection of visual defects

Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge

I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve

Cleaning Reworked BGA's.

Electronics Forum | Thu Aug 04 14:44:59 EDT 2005 | Shean Dalton

Hi Sandy B, You certainly can clean the BGA's using an inline or batch process. The correct method to hold them during this process, is the method that provides the desired outcome. I'm familiar with the desired outcome for cleaning singulated BGA

Wave Soldering Flus Selection

Electronics Forum | Thu Jun 14 22:50:45 EDT 2001 | gregH

Hi, I read an article that says "Flux selection usually depends on the following factors": a) Solderability of pcb base metal or coating b) Corrosivity of vapours and residues c) electrical resistivity of residues d) Ease of removal of residues e)

Re: no clean rework

Electronics Forum | Wed Aug 18 15:52:21 EDT 1999 | DENNIS FOWLER

| | | Gian | | | | | | You alarm me when you talk of white residues in a "no-clean" process. This should not happen. It sounds like you have compatibility problems between different residues and/or a poorly polymerised solder mask. | | | | | | Ther

Mixing No-clean and water soluble processes

Electronics Forum | Tue Feb 23 16:45:36 EST 2010 | dyoungquist

Davef is right on as usual. We are doing exactly what you do. Some smt with no clean paste then the plate through connectors on our selective solder machine using water soluble flux. We then clean with a ultrasonic water process. We do see the re

PCB residue after wave solder

Electronics Forum | Wed Jul 29 08:05:25 EDT 2009 | patrickbruneel

Deni, You also need to check if your flux is properly wetting the board. Flux dewetting on the surface can also cause webbing. You can check that with spraying flux on the board surface and watch the wetting behavior. Patrick

Re: wave solder

Electronics Forum | Fri Jun 12 14:22:53 EDT 1998 | Ryan Jennens

| Hey all! | The wave solder warrior is back. I have found a flux which leave almost no residue (the least yet), but because of its super low solids content I absolutely cannot get topside fillets. The multi-layer, two sided board is on a pall


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