Electronics Forum | Tue May 09 18:00:33 EDT 2006 | russ
in all actuality, you are both right. Alpha metals does have the toughest/hardest noclean residue that I have seen. When changing to no-clean FLUX you should run different probes. So back to square one. You're both right so who's gonna win?
Electronics Forum | Sun Jul 25 08:54:37 EDT 1999 | Tom Gervascio
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Sun May 16 13:10:36 EDT 1999 | Dave McDermid
| | | | | | | I left the company before this thing ever got resolved, so I don't know the answer, but here's what we did to get boards out the door. Baked them in a desicating oven. You know, the kind that pulls vacuum? It was a regular overnigh
Electronics Forum | Tue Oct 13 18:28:51 EDT 1998 | Graham Naisbitt
Upinder, Using IPA does not cause the residue, it simply exposes it. Given that all fluxes leave reisdues, it follows that these MUST be benign - but how do you know, and how do you control it. You are using flux to remove oxides and give you a go
Electronics Forum | Mon Dec 02 16:19:11 EST 2002 | slthomas
Unfortunately it's nc or we'd be worrying about this on the fly. Non-contact is defintely and issue....this is an 18"x9" board with 1500 bottom side SMT parts that are scattered among the through-hole and vice-versa. We're currently using 7 hold-
Electronics Forum | Wed Oct 04 17:15:23 EDT 2006 | russ
that question I think I will punt it on over to some of the experts here. I really do not the "why". voids for me have always been related to the escape (lack of) of the "stuff" that is in the paste. I have seen diff pastes perform differently rel
Electronics Forum | Mon May 10 20:46:25 EDT 2004 | davef
The three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinning operation. * Surface stripping chemistry and then a standard retinning operation. * Electrochemical conversion chemistry and then a
Electronics Forum | Thu Sep 06 13:19:36 EDT 2001 | mparker
The main criteria is at what frequency is the RF operating? If it's in the microwave region, forget no-clean. Low frequencies - 0 to 100 MHz, probably ok. Beyond that, it's application specific. Depends on components used and circuit design. The p
Electronics Forum | Tue Jun 10 08:27:18 EDT 2003 | davef
Q1: Suppose I want to qualify a SMT product for lead free, do I need to use a lead free solder paste or any other normal solder paste will do ? A1: Today, most solder pastes contain lead [Pb]. Q2: What are the impact of using a lead free solder past
Electronics Forum | Wed Jan 27 19:42:34 EST 1999 | parag palshikar
i am working with the noclean process and getting white residues on the bottomside of the board probably due to the wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperature a
