Electronics Forum | Thu Aug 22 15:31:52 EDT 2002 | Claude_Couture
In an oven with flux reclamation system, once the circulation is prevented by accumulation of flux in the heat exchanger, the flux will condense where it can, and some of it will coat your PCBs with a uniform layer of flux on the parts/ joints/ goldf
Electronics Forum | Fri Jun 02 17:33:51 EDT 2000 | Dave F
Hey CK, we�re all sodder googoo�s ... wanna be gurus Why donchu tell �em not to put sodder in your vias? Er, makit so the sodder won�t flow out of the bottom of the vias and cause dem stalactites? OK OK, here�s wacha do, modify the second side ste
Electronics Forum | Tue May 09 18:00:33 EDT 2006 | russ
in all actuality, you are both right. Alpha metals does have the toughest/hardest noclean residue that I have seen. When changing to no-clean FLUX you should run different probes. So back to square one. You're both right so who's gonna win?
Electronics Forum | Sun Jul 25 08:54:37 EDT 1999 | Tom Gervascio
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Sun May 16 13:10:36 EDT 1999 | Dave McDermid
| | | | | | | I left the company before this thing ever got resolved, so I don't know the answer, but here's what we did to get boards out the door. Baked them in a desicating oven. You know, the kind that pulls vacuum? It was a regular overnigh
Electronics Forum | Tue Oct 13 18:28:51 EDT 1998 | Graham Naisbitt
Upinder, Using IPA does not cause the residue, it simply exposes it. Given that all fluxes leave reisdues, it follows that these MUST be benign - but how do you know, and how do you control it. You are using flux to remove oxides and give you a go
Electronics Forum | Mon Dec 02 16:19:11 EST 2002 | slthomas
Unfortunately it's nc or we'd be worrying about this on the fly. Non-contact is defintely and issue....this is an 18"x9" board with 1500 bottom side SMT parts that are scattered among the through-hole and vice-versa. We're currently using 7 hold-
Electronics Forum | Wed Oct 04 17:15:23 EDT 2006 | russ
that question I think I will punt it on over to some of the experts here. I really do not the "why". voids for me have always been related to the escape (lack of) of the "stuff" that is in the paste. I have seen diff pastes perform differently rel
Electronics Forum | Mon May 10 20:46:25 EDT 2004 | davef
The three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinning operation. * Surface stripping chemistry and then a standard retinning operation. * Electrochemical conversion chemistry and then a
Electronics Forum | Thu Sep 06 13:19:36 EDT 2001 | mparker
The main criteria is at what frequency is the RF operating? If it's in the microwave region, forget no-clean. Low frequencies - 0 to 100 MHz, probably ok. Beyond that, it's application specific. Depends on components used and circuit design. The p
