Electronics Forum | Tue May 26 15:53:39 EDT 1998 | Chrys
| We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized to
Electronics Forum | Fri Jul 30 20:11:35 EDT 1999 | Mike Konrad
It is true that the use of saponifiers (and other water soluble additives) will lower the surface tension and aid in under component penetration. It is also true, however, that other specific design features within a batch machine can also aid in un
Electronics Forum | Wed Feb 14 16:58:12 EST 2018 | cbart
you would be best to get this from your paste/solder manufacture. but here are some rules of thumb: -Solder paste out of fridge before use - get out the night before needed.. don't let your op's warm on the oven!! you will regret that! if not over ni
Electronics Forum | Fri Mar 26 12:26:31 EST 2004 | Mike Konrad
Hi Patrick, With all due respect, it is easy to quantify zero. You made a claim that your flux produces ZERO residue. There are several industry-standards (IPC and Military) of determining the cleanliness of post-reflowed circuit assemblies. Th
Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Sep 01 16:16:17 EDT 2004 | DenisM
Hi, I have used these type systems in the past and had trouble with white residue and flux removal under low standoff components. All cleaning systems need DI water and this requirement adds another layer of system cost if you don't have DI availabl
Electronics Forum | Thu Mar 18 13:54:30 EST 1999 | John
| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet
Electronics Forum | Fri Mar 19 05:08:24 EST 1999 | Vinesh Gandhi
Hey Marc, I am not sure about the kind of process you are following. Is it Gluing+paste printing on the bottom side or just gluing on the bottom side and paste printing on the top side. The relationship which I could think of between Bottom side
Electronics Forum | Mon Jun 08 11:39:28 EDT 1998 | Earl Moon
| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr
Electronics Forum | Tue May 26 14:42:55 EDT 1998 | Justin Medernach
| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.
