Full Site - : void reduction (Page 8 of 16)

Torenko & Associates Sells the First IBL In-Line Vacuum Vapor Phase System in Texas

Industry News | 2012-01-26 23:09:03.0

Torenko and Associates recently sold Houston-based Mesa Engineering the first IBL In-Line Vapor Phase with Vacuum in Texas. The system was installed in mid-January 2012.

Torenko & Associates

SHENMAO Presents Technical Paper at SMTA/ICSR Conference

Industry News | 2016-04-21 00:17:09.0

SHENMAO Technology will present the technical paper "A New Dispensing Solder Paste for Laser Soldering Technology" at the 10th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.

Shenmao Technology Inc.

Kester Introduces EnviroMarkTM 919G Lead-Free Solder Paste Halogen-Free and No-Clean at Productronica 2007

Industry News | 2007-11-01 20:33:22.0

ITASCA, IL � November 1, 2007 � Kester announces it will launch the new EnviroMark 919G (EM919G) lead-free solder paste in Hall A4, Stand 363 at the upcoming Productronica 2007 exhibition and conference, scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.

Lloyd Doyle

FCT Assembly Debuts NL930 Lead-free No-Clean Solder Paste

Industry News | 2009-11-02 21:59:00.0

GREELEY, CO —FCT Assembly premiers NL930, a lead-free, no-clean solder paste that features the company’s latest technology in print and reflow of paste in the no-clean category.

FCT ASSEMBLY, INC.

One Minute to Understand AXI and Utilize It for Free

Industry News | 2019-08-15 07:31:59.0

AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.

Elecrow

Unicomp Technology Showcases Cutting-Edge Electronic Inspection Equipment at Shanghai Productronica Exhibition

Industry News | 2023-04-18 10:15:50.0

Unicomp Technology Showcases Cutting-Edge Electronic Inspection Equipment at Shanghai Productronica Exhibition

Unicomp Technology Co., Ltd

Fluxless soldering using formic acid vapor for optoelectronics

Industry News | 2023-11-20 15:33:13.0

Soldering using formic acid vapor in combination with nitrogen (HCOOH + N2) offers significant advantages in assembly and connection technology for applications in optoelectronics and photonics. Especially in the field of sub-micron bonding, Tresky has introduced several innovations in recent months and is now presenting the formic acid module for reliable use in bonding processes at productronica 2023.

Tresky AG

KIC and iTAC Software AG Integrate Smart Reflow Process Data in the MES i4.0 Solution

Industry News | 2019-01-17 20:29:01.0

KIC announces its partnership with iTAC Software AG, a leading Provider of MES premium solutions. The integration of smart Reflow Process Inspection (RPI) data analytics into the iTAC.MES.Suite ensures complete process control and traceability of the thermal process in the oven, previously referred to as the “black box” machine in the production line. This KIC-iTAC partnership creates new customer value for not only the reflow process, but for the entire production line, by providing process transparency, traceability, consistent quality and reduced costs through a new level of connectivity and automation. With the connection to KIC’s RPI data analytics iTAC now provides real-time insight into the reflow process to help factories run their production more effectively by reducing setup and changeover time, faster yield troubleshooting, and reduction in scrap and rework.

KIC Thermal

Henkel to debut new materials, share expertise at IPC APEX Expo 2018

Industry News | 2018-01-31 12:48:28.0

Coming off a historic 2017 during which the electronics business of Henkel Adhesive Technologies launched over 50 new products and enjoyed significant sales wins, the company is poised to have a repeat performance this year. At IPC APEX Expo in San Diego, CA, the Henkel team will showcase a host of new products in booth # 3001 and share its knowledge base in paper presentations during the event’s conference.

Henkel Electronic Materials

Kester Introduces EnviroMarkTM 923 Lead-Free Halogen-Free No-Clean Solder Paste at NEPCON China, Shanghai.

Industry News | 2008-04-07 20:17:14.0

ITASCA, IL � February 29, 2008 � Kester announces it will showcase EnviroMark 923 (EM923), a halogen-free, RoHS Compliant lead-free no-clean solder paste, in booth 2C04 at the upcoming NEPCON China/EMT China 2008 exhibition and conference -scheduled to take place April 8-11, 2008 in Shanghai, PR China.

Kester


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