Electronics Forum | Mon Aug 25 10:27:51 EDT 2014 | swag
You might look at "Tacsil". It's a product we've used over the years for stuff like this. It's basically a sheet of material that can be cut into any shape with scissors or X-acto that's sticky on both sides. It can go thru reflow a bunch of times
Electronics Forum | Mon Nov 17 14:02:33 EST 2003 | Mark Peo
As you have seen, the 1088 doesn't need much in the way of P.M. We recommend: --Monthly vacuuming in the base and under the hood (ie Dust Bunny control) --Lubricate Edge Hold Conveyor Chain and leadscrew (if the Edge Hold Conveyor option is installe
Electronics Forum | Tue Jul 18 00:15:37 EDT 2023 | hazira1991
Is a fresh lot. This bga is old date code 2010. we had received this BGA 2021 and the baking process is done during receiving time. Production received with vacuum seal , its very hard to tell how the BGA handling and stuff and the BGA already EOL. I
Electronics Forum | Thu Feb 28 07:57:52 EST 2002 | caldon
Marcos- BGA's and soldering manually is difficult. Typically soldering BGAs requires reflow just as a reflow oven does, so I recommend a rework station. Go to http://www.empf.org/html/empfset.htm and download Jan 2002, Dec 2001, Sep 2001, Aug 2001,
Electronics Forum | Fri Nov 08 11:37:44 EST 2002 | jonfox
1. Back in the early days of consumer digital cell phones, we ran into the same problem. PCB with 2000 parts in a 5"x2" area, and double sided. We ended up using our standard vacuum tooling for the NIC side and stiff ESD safe foam for the NAC side
Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ
Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply
Electronics Forum | Tue Aug 17 09:59:50 EDT 1999 | Earl Moon
I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the adve
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Thu May 24 17:37:25 EDT 2007 | jmelson
I did one batch of low-density (0805 and standard SO chips) with excellent results. I then spent some time figuring out how to calibrate the mechanical alignment station (most of the calibration offsets on this machine were either zero or several mm
Electronics Forum | Thu Jan 26 02:14:52 EST 2017 | jgo
Hi all, Am new to SMT here. I have a very thin laminate substrate which around 120um thickess. Being that thin, warpage is constantly an issue for us. For the solder printing part, we have a number of problems. Being so thin and warped, we need t
