New Equipment | Coating Equipment
PCB reliability test is an important link in optical communication industry chain. During the optical fiber communication, optical fiber laser industry rapid development, The customer need to change with each passing day and more changes. Wewon Tech
Industry Directory | Manufacturer's Representative
NASA STD-8739.3 or NHB 5400.3(3A-2) - Space & Military Manufacturing Contract Design and Manufacturing - Commercial ProductsCapabilities include automated SMT and PTH AssemblyThermal Cycling and Test Set DevelopmentQuick turn around/Quick responseTurn-key or consignment assembly
Manufactures a wide range of environmental test solutions capable of temperature and humidity cycling, thermal shock, production stress screening, accelerated stress testing, combined environment testing, controlled humidity exposure.
Register for the Webinar today:https://pages.zestron.com/multiple-thermal-cycle Multiple thermal cycles may be required for a variety of reasons in the production of printed circuit boards. If the PCB includes Surface Mount Technology (SMT) and Throu
Industry Directory | Consultant / Service Provider
Micom Laboratories Inc.’s test offering includes: UV testing, corrosion, temperature & humidity cycling, Thermal shock, Material testing, Package, Coating testing. We are ISO 17025 accredited.
New Equipment | Test Equipment
Clover Electronics has extensive test capabilities including, in-circuit, flyinig probe, customer supplied ATE, custom designed models, and thermal cycling. Give us a call and we can meet all of your testing needs.
Infrared IC Heater T962 is a micro-processor controlled reflow oven, works automatically by micro-computer control. It can satisfy a dissimilarity SMD、BAG soldering a request on a PCB assembly. The T962 may be used to automatically “re-flow&rdq
Industry Directory | Consultant / Service Provider / Manufacturer
We provide, high quality, one stop shop, contract EMS and general assembly services. We excel in all component placement capabilities, extensive test, sub-assembly, order fulfillment and distribution.
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
Technical Library | 2006-11-01 22:37:23.0
Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment. One such test can be the Deep Thermal Cycle (DTC) environmental stress which cycles from -55°C to 125°C. This “hammer” test provides the customer with a level of security for robustness, but does not typically represent conditions which a module is likely to experience during normal handling and operation.
