Industry News | 2022-10-11 17:18:48.0
Ever-more complex packaging of chips will be the key driver of future innovation, yet the United States and Europe are behind the curve
Industry News | 2023-04-17 08:38:56.0
IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments. The High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport in Linthicum (Baltimore), Md.
Industry News | 2001-01-23 10:47:30.0
IPC has recognized the winners of this year's Best U.S. and International Paper awards at IPC SMEMA Council's Electronics Assembly Process Exhibition and Conference (APEXSM) in San Diego, CA.
Surface Mount Technology Association (SMTA)
Industry News | 2003-02-18 09:39:06.0
Encourages You to Submit an Abstract for this Year's Conference
Industry News | 2003-04-21 10:24:56.0
Learning today for tomorrow's demands
Industry News | 2010-03-27 19:38:34.0
BANNOCKBURN, Ill, USA, - One of the fastest growing segments of the PCB market worldwide, flexible circuits provide new opportunities in the areas of creative design, miniaturization, circuit density and interconnection reliability to help boost a company’s bottom line.
Industry News | 2010-10-16 19:00:32.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO™, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, April 12–14, 2011, at the Mandalay Bay Resort & Convention Center, Las Vegas.
Industry News | 2011-07-14 11:46:04.0
SMTA is pleased to announce the expansion of the International Electronics Industry Roadmap track at the 2012 Pan Pacific Microelectronics Symposium at the Sheraton Poipu Resort in Kauai, HI, 14-16 February.
Industry News | 2012-06-08 07:14:00.0
SMTA just announced the Best of Conference Award recipient from the South East Asia Technical Conference on Electronics Assembly Technologies that took place April 18-20, 2012, in Penang, Malaysia. The Best of Conference Award was presented to Mike Bixenman, Kyzen Corporation, for his workshop on "Designing for Reliability - Cleaning Basics in the Age of High Density Interconnects." The workshop was very well-attended and received high scores from attendees.
