Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2010-06-11 15:59:00.0
BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries® has released the A revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the computer and telecommunications industries, including design for reliability, design qualification testing, manufacturing conformance testing and quality processes.
Industry News | 2010-11-18 11:21:04.0
IPC has released the training and certification programs for revision E of IPC-A-610, Acceptability of Electronics Assemblies, and J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies.
Industry News | 2019-11-05 12:11:26.0
ITW EAE is introducing the MPM® Momentum II™ Printer as the next generation of the highly successful Momentum printer line. The Momentum II features a new set of enhanced technologies that bring further advancement in quality, yield, productivity, ease of use and flexibility.
Industry News | 2014-09-16 11:25:27.0
The Surface Mount Technology Association (SMTA) announced today that Professor Ronald Lasky, Ph.D., Dartmouth College/Indium Corporation and Jim Hall, ITM Consulting, will be available in the SMTA BookStore on Wednesday, October 1 from 12:30pm to 1:30pm for a book signing.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2011-07-26 22:29:00.0
It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.
Industry News | 2003-08-27 10:58:00.0
Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting
Industry News | 2010-06-16 12:45:24.0
BANNOCKBURN, IL — The Solder Products Value Council (SPVC) of IPC — Association Connecting Electronics Industries® issued the organization’s position statement on conflict metals during a Supply Chain Workshop held on May 20, 2010, by the Electronic Industry Citizenship Coalition (EICC) and the Global e-Sustainability Initiative (GeSI) in Vancouver, British Columbia.
Industry News | 2011-09-12 15:38:48.0
IPC released the summer 2011 edition of its quarterly business report, Electronics Industries Market Data Update, showing slower growth in most national economies as well as in the worldwide electronics industry.
