Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2003-08-27 10:43:02.0
This 41-page document is the complete source for printed circuit board and electronics assembly standards and publications for design, materials, manufacturing, assembly, quality and test.
Industry News | 2012-08-01 16:17:40.0
Multitest, introduces a Signal and Power Integrity Glossary. The new glossary, developed by Ryan Satrom, Multitest’s Signal Integrity Engineer, explains the major terms and concepts related to power integrity.
Industry News | 2008-01-28 23:30:43.0
Library, Combined with Agilent's Advanced Design System, Reduces Development Costs and Increases Productivity for High-Speed Design
Industry News | 2005-06-07 06:52:14.0
Led by Dr Howard Johnson
University of Oxford Technology - Electronics, Telecoms & Engineering
Industry News | 2019-11-05 22:25:21.0
Backdrill is the process of creating vias by removing the stub in multilayer_ed printed wiring boards, to allow signals to flow from one layer of the board to another. It is a special craftsmanship of control depth drilling.
Industry News | 2003-03-04 08:54:06.0
To standardize its design flows and methodologies.
Industry News | 2013-05-31 13:26:07.0
Multitest,announces that Jason Mroczkowski, Signal Integrity Engineer, will present at the upcoming The IEEE Semiconductor Wafer Test Workshop in San Diego, CA. The presentation entitled, “High Frequency PCB Material Analysis,” is scheduled to take place Wednesday, June 12, 2013 from 10:30-11 a.m.
Industry News | 2010-10-14 15:54:00.0
Multitest now offers Test Interface Simulation to optimize test interfaces. Signal Integrity Simulation is valuable in understanding the performance of the test interface.
Industry News | 2007-10-23 14:43:19.0
Richardson, TX (Oct. 23, 2007) ASSET InterTech is expanding its ScanWorks� system by adding signal integrity analysis applications that support Intel's next-generation embedded instrumentation technology, Intel� IBIST (Interconnect Built In Self Test).
