New Equipment | Assembly Services
The board is designed by customer and it's for Set-Top Box PCBA board. We did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 4 Layer PCBA board Material: FR-4 TG180, Shengyi Thicknss
New Equipment | Assembly Services
The board is designed by customer and it's for TV Box PCBA board. We did One-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly). Product name: 4 Layer PCBA board Material: FR-4 TG170 Thicknss: 1.6mm Surfac
RCX Series Resistors Versatile Wrap-Around Chip With resistance values from 1ohm to 1Teraohm, RCX Series resistors are ideal for a wide variety of applications. Wraparound terminations are perfect for epoxy or solder attachmen
New Equipment | Fabrication Services
Large Format PCB's ACI has made substantial investments in the production of Large Format PCB's. This unique capability allows us to build plated-thru structures up to 24" wide by 102" in length utilizing almost any material type. We produce a vari
, FR-4 Tg170, ENIG.jpg)
New Equipment | Fabrication Services
High-density integration (HDI) technology enables the miniaturization of end product design while meeting higher standards of electronic performance and efficiency. Eastech has been focusing on high precision circuit board, continuously investing in
New Equipment | Fabrication Services
Multilayer PCB's ACI manufactures a wide variety of Multilayer PCB's for various applications spanning numerous industries and technologies. We can build your high layer count PCB's using a wide variety of high speed low loss materials from epoxies
New Equipment | Solder Materials
AIM’s REL22™ alloy is comprised of tin, bismuth, silver, copper, antimony, nickel and trace amounts of elemental grain structure refiners. The alloy provides significantly improved durability for use in applications where thermal shock, vibration and
Industry News | 2010-02-23 16:29:14.0
The Center of Advanced Life Cycle Engineering at the University of Maryland in collaboration with The Institute of Scientific and Industrial Research (ISIR) at Osaka University is pleased to announce the call for participation for the Fourth International Symposium on Tin Whiskers.
Technical Library | 2023-02-13 19:14:03.0
Technology Focus: Develop and evaluate nanoparticle filled conformal coatings designed to provide long term whisker penetration resistance and coverage on tin rich metal surfaces prone to whisker growth in commercial lead-free electronics used in modern DoD systems. Research Objectives: Identify the fundamental mechanisms by which conformal coatings provide long-term tin whisker penetration resistance and inhibit nucleation/growth. Correlate mechanical properties and coverage thickness to whisker penetration resistance. Project Progress and Results: Functionalized nanosilica and non-functional nanoalumina enhanced polyurethane conformal coatings have shown improved spray coating coverage characteristics and crack resistance during thermal cycling fatigue testing. Lead-free assembly whisker mitigation validation testing is in process. Technology Transition: Current project partners provide coating materials to industry. SERDP test data will be considered during updates to the DoD adopted IPC standards for coating materials and coverage.
Industry News | 2021-06-07 11:44:52.0
Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.
