367 ipc class 3 and class 2 results

Electronics Forum: ipc class 3 and class 2 (Page 8 of 37)

PCB Thickness and Score Depth Standards?

Electronics Forum | Fri May 24 17:35:59 EDT 2024 | dontfeedphils

A couple questions for everyone: 1) is there an industry spec that calls out v-score depth requirements? If so, what spec is that and what are the values? I've always heard 1/3 of the depth of the PCB on each side, but I'm not sure if that's a rul

Pre-bake times and temperature for polyimide boards

Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper

we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i

Re: Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F

| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl

Pick and Place vs CAD File

Electronics Forum | Sun Nov 26 01:50:32 EST 2017 | alexeis

Hi Ivan, Our solution works with 3 type of data with XY: 1. CAD - the best choice but, as you mention, I isn't available for all products. From our experience, it is available in 30%-50% of products. 2. IPC - This file available in 80%-90% of produc

Re: SMT training classes and start up equipment

Electronics Forum | Sat May 09 12:01:51 EDT 1998 | Bob Willis

If you need some training materials have a look at my Internet Web Page www.bobwillis.co.uk I have the second largest video list on electronic assembly second only to IPC. I have the largest range of CD ROM and Poster sets which may be of interest. M

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef

People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t

Re: Solder mask materials and equitements wanted

Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F

| Hi, Friends, | Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! | Have a good day | Xingsheng Xingsheng: Consider the follo

Stencil Printing Process Troubleshooting and control

Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas

Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi

Re: Bow and Twist of PCB's

Electronics Forum | Wed Aug 19 08:00:55 EDT 1998 | Earl Moon

| Hi there, | I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In orde

Help finding a high capacity pick and place machine

Electronics Forum | Tue Mar 19 14:57:48 EDT 2024 | spoiltforchoice

I hadn't suggested the IINEO's because as a step up from Neoden's its a huge leap in price and perhaps around twice the price of the AM100, that gap would narrow as you purchased even more feeders. If you have a big product mix or are a small batch