Electronics Forum | Thu Mar 25 11:30:33 EDT 2010 | Sean
Hello Rajeshwara, If not mistaken, the 25% solder void specification is for BGA...As I I as know, no specification given to mosfet component yet..I think you are right, I need to look at the stencil aperture in order to reduce the air trap underneat
Electronics Forum | Wed Jun 30 20:09:07 EDT 1999 | Mark
| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu
Electronics Forum | Sat Apr 16 13:43:53 EDT 2005 | KEN
What about electo migration? I had (what apears to be) the exact same problem you describe. X-ray and ICT fails to detect micro shorts. However, in our test, the bench functional test would show a current overload. In some cases the electro migrti
Electronics Forum | Wed Feb 09 13:07:01 EST 2000 | Jeff Woodruff
I have seen an issue that escapes our ICT and functional testing or operates in an intermitent fashion. The lead is slightly separated from the PCB with a fully formed solder joint behind it at the heel an toe. The joint apears to have started to tra
Electronics Forum | Tue Jan 30 02:38:50 EST 2001 | arul2000
This BGA could have gone through the reflow cycle two times as we understand from the BGA manufacturer, during the BGA ball attachment process. (If any ball is found missing, they replace the missed ball manually after applying flux manually and refl
Electronics Forum | Mon Jul 08 09:52:37 EDT 2002 | gdstanton
Folks, Looking for some feedback from anyone who has had experience with panelized or palletized CCAs, or anyone interesting on commenting, where interconnects were used to facilited a "gang" incircuit and functional test. We are considering implem
Electronics Forum | Tue Nov 06 07:34:26 EST 2007 | scottp
I'm not sure what kind of marginal joint you're trying to identify, but when we went through a serious ball-in-cup problem a few years ago we tried hot & cold functional test as well as a day or two of -40/+125C thermal cycling and all were pretty po
Electronics Forum | Sat Sep 13 07:00:09 EDT 2008 | mun4o
Hi, Why aren't the defective LED blinking? * Do the defective LED blink when removed from the board and tested according to the functional test that you used prior to assembling the boards? - yes,some of them. * Do the defective LED blink after the
Electronics Forum | Mon Dec 01 14:40:54 EST 2008 | snaggletooth
DC powered Power-up and ageing burn-in equipment, preferably non-product specific, starting from room temperature down to -41 degrees celcius and up to +71 celcius at a rate of 7 celcius per minute. But anyone who could suggest a manufacturer would b
Electronics Forum | Fri Jun 25 00:16:11 EDT 2010 | leadthree
I got a report from Yageo yesterday with microsections and and and..... result: Cracks I did a test run on boards after ICT, but before coating. They are all ok. Seems the cracking happens somewhere after the ICT. But at that stage all assembly is a
