New Equipment | Solder Materials
NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC
New Equipment | Cleaning Agents
MICRONOX MX2100 is an aqueous, single-phase solvent designed to remove tough flux residue from PMIC devices including IGBT modules and power MOSFETs. MX2100 has a well-balanced formula that provides outstanding cleaning performance and metal compatib
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
The SF Lead-Free Reflow Oven Series provides higher throughput with a choice of eight (8), ten (10), or twelve (12) heating zones and 17.7" (450mm) adjustable wide conveyor for production runs. Utilizing our patented Horizontal Convection Heating t
New Equipment | ESD Control Supplies
CL-5001 is specially formulated to removes dirt and spots from static-protective surfaces like matting, laminates, benchtops, and portable field surface kits. It is non-abrasive, non-streaking, and non-flammable, therefore it can be used on any washa
New Equipment | Cleaning Equipment
15 L Digital Ultrasonic Cleaner for Pcb Features: Removes solder paste and flux residue Will not damage delicate assemblies Cleans components with blind holes or complex geometries Uses aqueous or semi-aqueous cleaners Increases reliability
New Equipment | Solder Materials
Product name: Halogen Free Lead Free Solder Wire Product code: E9650-HF961 Alloy composition: Sn/Ag3.0/Cu0.5 Diameter: 0.2mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm Packing: 500g/reel, 1kg/reel (10kg/box) Price: Contact us for best price Features:
New Equipment | Cleaning Agents
IONOX® I3955 is a precision vapor cleaning solvent designed as a drop in replacement for modern era vapor degreasing equipment. IONOX® I3955 is effective in removing no clean and rosin flux residues from electronic assemblies including low stand-off
New Equipment | Solder Materials
Fluxes for use with Tin/Lead Solder. EQ-392 No-Clean is a homogeneous mixture of halogenfree, low solids organic flux designed for wave-soldering conventional and surface mount PCB assemblies. EQ-392 provides superior foaming characteristics with a
New Equipment | Cleaning Agents
AQUANOX A4638 is an engineered cleaning solution designed to remove flux residue from flip-chip and low clearance components on electronic assemblies and advanced packages. Due to low surface tension, AQUANOX A4638 removes water-soluble polar flux re
