Electronics Forum | Thu Jan 18 15:28:10 EST 2007 | CK the Flip
If you are, in fact, running a No-Clean solder paste: Different no-clean solder pastes will leave different types of (benign) residues. If your paste has been qualified from a Bellcore/SIR/Electromigration standpoint, any residues remaining will NO
Electronics Forum | Thu Nov 09 05:21:38 EST 2006 | jnaligan
hams, whats the result?
Electronics Forum | Tue Oct 31 01:32:47 EST 2006 | hanocete
thanks for your reply, actually we bake the PCB assembly prior the rework because the package was exposed for quite some time already. The baking time was 24hrs @ 125 deg.C. We notice that there were flux residues on the connectors after the baking.
Electronics Forum | Tue Oct 31 21:49:38 EST 2006 | davef
First, we assume the white residue is only on the connector and not on other components. That would imply that either: * White stuff was on the connector when it came in-house from your supplier. [Confirm this theory by baking some connectors from
Electronics Forum | Sun Oct 29 22:41:29 EST 2006 | hanocete
We have a current problem on our packages after we bake it for 24 hrs prior BGA rework. Flux or white residues found on the connector leads and terminals that cause not contact problems during mating. Could you help us how to clean the fluxes properl
Electronics Forum | Thu Nov 02 18:28:20 EST 2006 | hanocete
Thank you very much for your reply, we'll try to perform your advice. I'll feedback you soon for the results. 'till then...
Electronics Forum | Mon Oct 30 21:43:08 EST 2006 | davef
So, after the repair of a BGA, you notice white reside on a nearby connector. Correct? [Sorry we're so dense. Long day.] Tell us about: * Flux class used in repair * Flux class used in original assembly Why are you baking the assembly after repair
Electronics Forum | Mon Dec 13 16:25:37 EST 2004 | saragorcos
Hi Scott - No clean assemblies have a very low tolerance for processing residues, and long term reliability is compromised if residues from incoming bare boards, components, or un-solublized flux residues are not dealt with. It is critical to contro
Electronics Forum | Mon Oct 30 20:24:35 EST 2006 | davef
As we understand it, you: * Get some nice BGA from your supplier * Find BGA to be packaged properly * Bake the BGA for 24 hours at [what temperature?] to reduce the potntial for damaging moisture sensitive components during following processes * Remo
Electronics Forum | Thu Jan 28 08:42:43 EST 1999 | Dave F
| i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperatu
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