Electronics Forum: failure modes (Page 8 of 9)

soft gold vs immersion gold

Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef

90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125

adhesive on pads

Electronics Forum | Sat Mar 30 17:27:45 EST 2002 | davef

You should not have glue "all over the place." Tou should not have glue on solderable surfaces. It sounds like you are stringing glue from one dispense location to the next. Search the fine SMTnet Archives [there might be something there]. Read a

Re: Drying ICs any advice

Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson

| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin

Contact Systems CS-400E Optical Correction

Electronics Forum | Mon Feb 16 07:11:25 EST 2004 | paul_bmc

Does anyone know how often the optical sensor goes bad on the CS-400E machines. I have 2 machines and it seems that the optical correction does not work anymore. I keep getting an optical correction error, when the mode is turned on the correction

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

Re: seeking low cost fix to tce mismatch

Electronics Forum | Thu Dec 30 21:22:12 EST 1999 | Jim

Mike, Thanks for the reply. It's not really a matter of slope. It is the long term thermomechanical fatigue that the solder joint undergoes as a result of repeated severe temperature swings, while the product is in use. Non-leaded parts are suscep

"Base Hole Error" message from hole inspection machine

Electronics Forum | Tue Oct 05 16:38:51 EDT 2010 | tskim83

Our hole inspector gives this error message “Base Hole Error”. It is a flat conveyor-type hole inspection machine from YAYATech that scans PCBs, with an optic sensor and cameras on top of the belt and a light source on the bottom of the belt. And dur

Where do I Start?

Electronics Forum | Tue Sep 10 12:17:42 EDT 2002 | dragonslayr

Genny - one more reply from the chorus. Do consider why Contract Manufacturing came into vogue in the first place. It allows OEMS the opportunity to focus on what they do best, design and marketing/sales. It also reduces the overall costs of doing bu

fiducial mark

Electronics Forum | Wed Mar 03 13:33:25 EST 2004 | stefwitt

How well should the fiducial be centered in the teach mode? Consider that you see the fiducial with probably 40 times magnification on the monitor. If you see the cross-hair a bit off center, then this is most likely just by a few hundreds of a milli

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b


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