Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Technical Library | 2021-03-10 23:57:29.0
Latent short circuit failures have been observed during testing of Printed Circuit Boards (PCB) for power distribution of spacecraft of the European Space Agency. Root cause analysis indicates that foreign fibers may have contaminated the PCB laminate. These fibers can provide a pathway for electromigration if they bridge the clearance between nets of different potential in the presence of humidity attracted by the hygroscopic laminate resin. PCB manufacturers report poor yield caused by contamination embedded in laminate. Inspections show ...
Technical Library | 2019-01-02 21:51:49.0
Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.
Technical Library | 2016-05-13 11:44:16.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Technical Library | 2023-01-10 20:08:36.0
Nickel corrosion in ENIG and ENEPIG is occasionally reported; when encountered at assembly it manifests as soldering failures in ENIG and wire bond lifts in ENEPIG. Although not common, it can be highly disruptive, resulting in missed deliver schedules, supply chain disruption, failure analysis investigations, and liability - all very costly.
Industry News | 2017-11-16 16:06:44.0
STI Electronics recently hosted the Covenant Christian Academy for Manufacturing Day (MFG Day).
Industry News | 2014-01-06 09:45:48.0
Datest a recognized leader in PCBA testing, test engineering, and inspection services, commemorates 30 years in business in 2014.
Industry News | 2022-09-15 06:29:44.0
As part of its electric vehicle (EV) focused series of webinars, Driving e-Mobility: Rel-ion™ Technical Webinars, Indium Corporation's Jonas Sjoberg, associate director for global technical service & application engineering, and Ângelo Marques, applications engineer – design for excellence (DfX) specialist, will share considerations for the implementation of high-density assembly in the automotive space.
Events Calendar | Thu Aug 23 00:00:00 EDT 2018 - Thu Aug 23 00:00:00 EDT 2018 | ,
Strain Gauge Data Can Be Misleading | Predicting Strain Levels Caused by Mounting PCBs in Housing Using the ICT Analysis Feature of Sherlock
Industry News | 2011-10-03 15:28:11.0
OptoTherm (www.optotherm.com), a manufacturer of thermal imaging systems for electronics failure analysis, announces the addition of a new sales representative for Malaysia.
