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Tropical Assemblies, Inc.

Industry Directory | Manufacturer

Tropical Assemblies, Inc. is a 20 + year Electronic Contract Manufacturer of RF and Complex Printed Circuit Board Assemblies. Full turnkey operation from prototyping to full production box builds. AS9100/ISO Certified, ITAR reg.

Seamark Zhuomao Semi-automatic SMD rework station ZM-R720A for BGA and LED Repair

Seamark Zhuomao Semi-automatic SMD rework station ZM-R720A for BGA and LED Repair

New Equipment | Rework & Repair Equipment

ZM-R720 Features Features                                                            1. Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired 2. Suitable for LED lamp beads of tape packaging an

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

FINEPLACER pico rs - High Density SMT Rework Station

FINEPLACER pico rs - High Density SMT Rework Station

New Equipment | Rework & Repair Equipment

FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allo

Finetech

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12" x 12")

New Equipment | Rework & Repair Equipment

Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,

PACE Worldwide

Conformal Coating over No Clean Flux Residues

Technical Library | 2015-03-04 10:56:26.0

As the proliferation of modern day electronics continues to drive miniaturization and functionality, electronic designers/assemblers face the issue of environmental exposure and uncommon applications never previously contemplated. This reality, coupled with the goal of reducing the environmental and health implications of the production and disposal of these devices, has forced manufacturers to reconsider the materials used in production. Furthermore, the need to increase package density and reduce costs has led to the rapid deployment of leadless packages such as QFN, POP, LGA, and Micro-BGA. In many cases, the manufacturers of these devices will recommend the use of no clean fluxes due to concerns over the ability to consistently remove flux residues from under and around these devices. These concerns, along with the need to implement a tin whisker mitigation strategy and/or increase environmental tolerance, have led to the conundrum of applying conformal coating over no clean residues.

AIM Solder

PRESS RELEASE: IPC APEX is 2 Weeks Away!

Industry News | 2018-02-08 09:25:01.0

IPC APEX 2018 is 2 Weeks Away! Visit YINCAE at Booth 2732

YINCAE Advanced Materials, LLC.

YINCAE at IPC APEX EXPO 2019

Industry News | 2018-12-28 14:03:00.0

IPC APEX 2019 is 1 month away!

YINCAE Advanced Materials, LLC.

YINCAE at iMAPS 2019- Boston

Industry News | 2018-12-31 16:21:47.0

YINCAE is attending iMAPS 2019- Boston!

YINCAE Advanced Materials, LLC.

YINCAE at iMAPS New England

Industry News | 2018-12-31 16:23:07.0

YINCAE is attending iMAPS New England

YINCAE Advanced Materials, LLC.

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

Industry News | 2012-09-10 09:15:27.0

MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.

Finetech


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