Electronics Forum: adhesion (Page 8 of 144)

SMT adhesives

Electronics Forum | Fri Sep 24 09:48:28 EDT 1999 | Shane

I am developing a DOE for evaluating SMT adhesives. I would like to evaluate 3 different vendor dispensing adhesives. I currently have the Heraeus PD955M and the Loctite 3609 and 3618 selected for evaluation. I would like to add another manufactur

Re: Stenil printing adhesive

Electronics Forum | Wed Oct 14 10:04:02 EDT 1998 | Dr. Kantesh Doss, Siemens Energy & Automation, Inc.

Sanjay: Keys to successful adhesive printing are: 1. Understanding the flow behavior of the adhesive under constant shear stress 2. Stencil design, i.e. stencil aperture opening 3. PWB Footprint 4. Stencil printing parameters Optimizing all these fac

Screen Printing Adhesive on Mixed Technology Boards

Electronics Forum | Mon Nov 26 15:30:35 EST 2001 | jhingtgen

To all, For the benefit of everyone there will be a session conducted at APEX on this topic. I have included the information that I pasted from the APEX website (http://www.goapex.org). ADHESIVE PRINTING Chris Marinelli, Loctite Tuesday, Janua

Adhesive printing

Electronics Forum | Fri Feb 01 10:19:22 EST 2002 | cyber_wolf

Whoa! I beg to differ my friend. The cure profile is VERY critical in Adhesive curing, especially if your are screen printing. When you screen print adhesive you are leaving it exposed to the atmosphere for a period of time. SMT adhesive by nature i

Re: Cure/Reflow Profile

Electronics Forum | Wed Feb 23 09:08:55 EST 2000 | Sal

Hey Guys, Thanks for the input and suggestions. Just been onto the adhesive manufacturer who reckons they should be no issue using a reflow profile for curing his adhesive , as long as the profile duration is not 6 minutes or over, which would bake

2-sided Process

Electronics Forum | Mon Jul 10 15:13:56 EDT 2000 | Mark Charlton

I know it's been brought up a thousand times before but after an hour of searching the archives I'm taking a short-cut. When processing one side of a double-sided assembly with adhesive, should the adhesive side be processed first or should "side" c

Re: Cure/Reflow Profile

Electronics Forum | Wed Feb 23 09:08:55 EST 2000 | Sal

Hey Guys, Thanks for the input and suggestions. Just been onto the adhesive manufacturer who reckons they should be no issue using a reflow profile for curing his adhesive , as long as the profile duration is not 6 minutes or over, which would bake

Adhesive Application by Stencil

Electronics Forum | Thu Mar 22 16:19:40 EST 2001 | rwilliams

In regards to SMT adhesive application by stencil: Can anyone make any recommendations for: SMT Adhesive Material itself? Squeegee Blade Material? Stencil Material? Characteristics/Features of your Stencil? E.g., thickness, aperture ratios, etc... P

Bottom side adhesives

Electronics Forum | Tue Oct 26 11:22:45 EDT 1999 | Morris

I am evaluating a bottom side glueing process. I was wondering if anyone could share their shear force specifications, or how they were developed. I would be most interested in the 0805 and Sot23 package types. Also, does anyone know if heating th

screening adhesives

Electronics Forum | Thu Aug 26 03:22:06 EDT 1999 | Jacqueline Coia

Hi There, Could anyone please give me some pointers on screen printing non-conductive adhesives or where I could find the information avaliable. Aspects such as printing parameters, ideal stencil design and a general overview. Do already have a part


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