Electronics Forum | Tue Nov 19 21:38:39 EST 2019 | zack
Hello, The first thing that you need to do is to make process mapping about this incident, so you can exactly determine all factors and observable changes happened during 2 weeks of timeline difference. According to my experience, if all equipment
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Jul 02 09:22:20 EDT 2008 | dmunson
Thanks Real Chunks. We currently have an RPS opus selective solder machine that we plan on keeping. It is configured as a 3-nozzle (!) one-pump (!!) point selective solder machine w/ nitrogen preheat. Custom wet nozzles. We use lead free SN100C sold
Electronics Forum | Thu Feb 10 22:55:50 EST 2000 | Dave F
Fred: I'm tryin' my darndest to be good, because, for whatever stupid reason, I feel that you're making an honest inquiry and not just floating something to find the biggest sucker. If only Earl was still here, he'd always bite on stuff like this.
Electronics Forum | Fri Apr 07 15:13:44 EDT 2006 | rsmith
Consider using 100% nitrile gloves or finger cots. They are ESD safe and will not break out the skin like latex will. Cotton can absorb flux, solder, etc and will leave a lint residue however it is considered ESD safe.
Electronics Forum | Wed May 27 15:54:09 EDT 1998 | Chrys
| | | | | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not loca
Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc
Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can
Electronics Forum | Fri Mar 26 15:36:50 EDT 2010 | krish_bala
Hello Graham, We are currently using Tacky Gel Flux during our replacement process. We dip the BGA component on the flux prior to placement. Once it is dipped, the alignment and placement is done. As for the profile, I believe I am hitting the corr
Electronics Forum | Mon Jul 26 21:00:49 EDT 2004 | davef
If you do not bring your nc flux to soldering temperature [~220*C], it is very dangerous from a product reliability standpoint to leave that material on your board. Consider: * TP-1115 - Selection And Implemetation Strategy For A Low-Residue, No-Cle
Electronics Forum | Wed Oct 10 13:59:49 EDT 2007 | petep
I have always understood that on boards (or circuits) operating over 900 MHz, No Clean fluxes are to be avoided. Apparently the residues left behind, while non-conductive and non-corrosive, will change impedence of the circuit. It may be a possibil
