Electronics Forum | Mon Aug 14 12:46:41 EDT 2017 | deanm
Any of the comments so far could be valid. To add my opinion, it looks like the pad size is too large. A smaller volume of solder will pull less than a larger volume. If you can't change the pad sizes, then the next thing to try is to get another ste
Electronics Forum | Tue Mar 24 10:34:03 EDT 2020 | slthomas
My experience with our process is that those parameters would result in a big bridging problem. I'm working with a stencil designer at our fabricator on an asymmetrical aperture design that hopefully balances forces enough to keep the parts centered.
Electronics Forum | Mon Mar 02 04:20:27 EST 2009 | emmanueldavid
Glossy/Matte & Plating). 2. Select Solder Paste according to Your Customer or In-House Specifications which is compatible for expected Process. 3. Use Chemical Etch / Electro Polished Stencil with proper Aspect Ratios (AR=>1.5) & Area Ratios(ArR=>0.6
Electronics Forum | Wed Sep 15 19:01:39 EDT 1999 | DGrenier
| | I'm hoping to use 0201 caps and resistors in a new design but so far have only found one company who makes such small devices (Murato). | | | | Can anyone direct me to any other supplier? | | | | Are there any particular problems associated wi
Electronics Forum | Fri Oct 02 11:14:10 EDT 1998 | Scott Cook
| I am experiencing solder paste comtaminatin of nozzels on 0603 size components resulting in missing components. The machine is failing to alarm under these circumstances. Has anybody else experienced this problem & found a solution? | Ben, We us
Electronics Forum | Tue Mar 17 13:11:58 EST 1998 | ETS, LLC
ETS (Energy Technology Systems) is a manufacturer of Solder Reflow and Curing Ovens for the Electronics Industry. We offer a specially configured oven designed for processing of Pin in Paste processes as well as double sided mix technology boards. I
Electronics Forum | Wed Jan 16 20:08:48 EST 2002 | davef
Comments are: * Some people use calibrated boards and components to remove sources of variation when using their CMM to measure placement accuracy. Sources of supply are listed in the fine SMTnet Archives. * It�s unclear that a single board will mee
Electronics Forum | Fri Oct 17 22:36:35 EDT 2008 | arosario
Hi All, We just started build a new product and I am encountering many non-wet rejects in our new product. I need help on what should I look into to improve our Yield. Please see below back ground 1. We are using DEK Infinity as printer. 2. We are mo
Electronics Forum | Tue Aug 18 10:11:04 EDT 2009 | grantp
Hi, Yes, I think this sounds like a form of tomb-stoning, and we used vapor phase until it ended up driving us totally nuts trying to deal with tomb-stoning. We tried everything, and all kinds of stencil apertures. Vapor phase is an amazing process
Electronics Forum | Mon Jan 09 23:24:47 EST 2017 | saju86ece
Hi, We are doing pin in paste reflow process in one our product ( but paste printed on bottom side of the board and top side will be assembled through hole component)in which faced cold solder issue in THT capacitor location after reflow. The solder
