Electronics Forum | Fri Mar 20 10:27:58 EDT 2009 | joelperez
Hello, Has anyone dealt with the process of listing the substances on their electronic products due to REACH? I'm trying to find out if there is a way to globally calculate the area ratio of all the apertures on a solder paste stencil so I can calcu
Electronics Forum | Wed Jul 01 03:05:56 EDT 1998 | Jon Gruett
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Wed Aug 15 18:48:58 EDT 2001 | mparker
I would consider the fab placement in the printer to be of more concern than the pro's and con's of a single foil for top and bottom print. Do to the larger size of the fab you will have to align the top and bottom layers sequentially on the foil. O
Electronics Forum | Wed Jun 09 15:03:53 EDT 1999 | Earl Moon
| In past PCB designs I have cleared all traces from all layers | (except pwr/gnd) from fiducial area. It has come to my attention that this is only necessary on the side where fud is placed. Which is the correct method of design using a fidicial?
Electronics Forum | Fri Jan 21 10:40:15 EST 2000 | Dave Chapman
Having adjusted the profile speed slower and adjusting the temps to the recommended lower levels, amazingly the mid chips have almost disapeared (90%). It appears they have been trying to run a "1 profile fits all" on the ovens for Alpha 737 and UP78
Electronics Forum | Tue Jun 04 17:21:22 EDT 2002 | jasonfang
I found solderballs are around chip components (on one side of middle area), I checked gerber data, solder paste of aperture on the stencil for these chip components have 5% reduction to solder land on PCB, shape of solder land are square, not home p
Electronics Forum | Thu Jan 26 11:42:58 EST 2012 | davef
Here's what we hear you saying: * Trying to repair a printed circuit board assembly * There's a problem replacing a 57 pin, 20 thou connector * Can't get enough solder paste on the connector leads * Printing paste, replacing the connector, then reflo
Electronics Forum | Wed Jul 06 15:26:12 EDT 2022 | glasscake
No experience with low temp solders for PIHR but we do use standard lead free 245-255 peak profiles on high temp connectors frequently. Honestly the added cost of the high temp connector pays for itself in labor. I almost always use oversized apertu
Electronics Forum | Wed Nov 02 11:01:56 EDT 2022 | tommy_magyar
Ellaborating on Evtimov's answer: - solder paste type, think about solder granulation and viscosity. Both of these will directly affect print quality if wrong print parameters used. You will normally find recommended print parameters on the solder pa
Electronics Forum | Fri Aug 10 18:06:52 EDT 2012 | mfergus
Anyone have experience printing solder paste for a Toshiba SSM3K15CT(TPL3) FET with CST3 package? Using 1 to 1 rectangular apertures with a 4 mil stencil and Alpha OM 338 #4 powder size lead free solder paste. Print head speed is 15 mm/sec and solven
