Electronics Forum | Wed Jun 16 08:56:34 EDT 1999 | Vic Lau
Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,either a
Electronics Forum | Wed Mar 17 19:58:00 EST 1999 | Marc Ruggiero
Hi folks, I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and sometimes f
Electronics Forum | Mon Sep 28 12:30:55 EDT 1998 | Bill Schreiber
Remember, even if you are successful in your justification of not cleaning your final product, there will always be a need for cleaning. Screens, stencils, misprinted PCBs, wave solder pallets, squeegees, tooling, etc. New cleaning applications can
Electronics Forum | Fri Mar 06 22:52:16 EST 1998 | Scott McKee
| I will be starting a conformal coating process soon, I am looking for any pointers on | 1) Best method for masking components, tape mask, liqued mask Masking tape or rubber caps will work, the ligued mask is too hard to remove. | 2) Which is best
Electronics Forum | Tue Aug 21 03:42:55 EDT 2001 | mugen
SMT community, My Fellows, 1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? 2) why is water-soluble (WS) not a hot choice? 3) All I know, *is in layman terms*, that BGA has tendency to trap water, should WS process be the c
Electronics Forum | Mon Oct 15 13:41:49 EDT 2001 | bschreiber
Hi Dale, I have copies of the articles of which Mike references. If you need copies for support, contact me at: bill@smartsonic.com. Rinsing should be done by ultrasonics also. Spray in atmosphere systems will not penetrate into the same tight ar
Electronics Forum | Tue Aug 27 11:08:24 EDT 2002 | slthomas
We use an evaporator, so that we only have a sludge of flux residue and solder metal to dispose of via the hazmat handling service. We also route stencil washer waste water into it. We use a 30 gallon drum and have it hauled off maybe twice a year,
Electronics Forum | Thu Feb 27 12:23:47 EST 2003 | woodsmt
James, Have you considered going to a No-clean process? BGA's can be difficult to impossible to clean using an aqueous process. The water just won't penetrate under the entire BGA and efficiantly remove your flux residues. The tighter the pitch
Electronics Forum | Fri Feb 28 10:32:45 EST 2003 | pjc
Cookson Electronics Equipment- Electrovert AquaStorm 200 highly recommended options: Checkmate Conveyor Hurricane Jets in Wash and Rinse 4 Additional Top Spray Bars in Wash *Closed Loop Filtration System for Wash *Positive Displacement Chemical Meter
Electronics Forum | Wed Jan 14 10:07:38 EST 2004 | Patrick
More on QFP soldering issue as per Paul f original e-mail. 1. Problems occured on different PCB's, on different lines using different equipment 2. Flux residue is common in the dimple on the solder. 3. The fault occurred using both "Kester 265" & "Al
