Electronics Forum | Thu Mar 25 20:50:50 EDT 2021 | stephendo
A couple more things. The PCB. What size are the pads? One time a board shop had difficulty putting masking between the pads of a QFP and the pads suffered as a result. When I told them they didn't have to have masking between the pads, the pads w
Electronics Forum | Mon Dec 21 17:50:55 EST 1998 | anamonus
| I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is 1
Electronics Forum | Tue Jun 28 14:06:08 EDT 2011 | dmiller
If you have room, and the aperture size will allow for it, try a 5 mil overall stencil thickness with a 1 mil step-up in the area of the BGA connector.
Electronics Forum | Tue Sep 29 21:39:07 EDT 2020 | kylehunter
Hi, We are currently working on a board that has 3x 50-pin THT at 1.27mm pitch each. This is too small for us to be able to consistently do on our selective solder. We are instead considering pin in paste. The connector we are using can be spec'd at
Electronics Forum | Thu Dec 08 10:48:21 EST 2005 | JP
Thanks Russ. As I was writing the post, it crossed my mind that stencil thickness is probably incorrect. I did not question the thickness because it was something that has been discussed with our stencil fabrication shop. When we were ordering mini
Electronics Forum | Tue May 03 23:27:03 EDT 2016 | adamjs
I've successfully refrigerated a pasted board, and placed/reflowed it the next day with minimal issues. Me too. I'm looking for more than one day. > You might want to invest in a stencil cleaner Tried that. They do not work on the high-aspect ra
Electronics Forum | Wed Feb 25 02:33:52 EST 1998 | Scott McKee
| | Stencil Opening | | Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable | Ron, | Use a six mil foil thickness for your stencil. Go one to one with yo
Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach
| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm
Electronics Forum | Fri Mar 20 10:27:58 EDT 2009 | joelperez
Hello, Has anyone dealt with the process of listing the substances on their electronic products due to REACH? I'm trying to find out if there is a way to globally calculate the area ratio of all the apertures on a solder paste stencil so I can calcu
Electronics Forum | Wed Jul 01 03:05:56 EDT 1998 | Jon Gruett
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
