Electronics Forum | Wed Jul 25 16:06:35 EDT 2001 | cnotebaert
As Dave said you should be concerned about separation. If you open the jar and see that the flux has separated from the paste ditch it. I guess I am a little more hesitant than others, I would discard the material and use fresh. You have to way the c
Electronics Forum | Sun Jan 30 03:06:50 EST 2000 | Roni H.
Hi, The major reason is that the flux is still "wet", you should fix the temp. profile (specialy preheat zone) so the evaporation of flux carriers will be better (anyway not to much !). Recommended: 1st preheat zone heating to ~70C , 2nd&3rd prehea
Electronics Forum | Mon Dec 27 13:28:11 EST 1999 | Brian W.
Depending on the components you are seeing this on, one thing to check would be the solderability of the parts. Sometimes you will find the plating leeches away, and this is a component plating issue. When you solder, the plating actually leeches a
Electronics Forum | Wed Dec 15 09:47:31 EST 1999 | Wolfgang Busko
Hi Chris, the same reduction as for fine pitch (10-15%)has decreased the amount of solderballs enormously. Sure, with adequate pad design and good printing equipment and processcontrol you can get the same results but it does no harm as long as you
Electronics Forum | Thu Dec 09 15:14:41 EST 1999 | Ron Costa
I have been seeing wetting problems with Texas Instruments componets. I am using Kester 596L OA water soluble solder paste. My reflow profile is in spec. for this formula. Has anybody else seen this problem and if so how did you resolve it? Any feed
Electronics Forum | Mon Dec 13 16:07:38 EST 1999 | Travson
Russ, Regarding your no clean soldering to gold. We have been doing that for about three years now. We have been using 62/36/2% silver solder paste. I have not done any thorough testing as to joint strength but the finish is shinier. It looks li
Electronics Forum | Fri Oct 29 09:36:42 EDT 1999 | Dave F
Chris: Thanks. SMTnet has a "Library." Buried deep within it is a listing of terms. The following is from that listing: Shadowing. When a component blocks the heat or solder wave flow from certain areas of the printed circuit board, resulting in
Electronics Forum | Wed Aug 18 11:18:22 EDT 1999 | GREG DENHAM
WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS. IS TH
Electronics Forum | Wed Aug 18 11:25:12 EDT 1999 | J.J. Thomas
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Thu Jun 24 12:43:08 EDT 1999 | Earl Moon
| | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody h
