Electronics Forum: stencil apertures (Page 65 of 121)

solder paste printing

Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf

“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of

Re: Any help reflow soldering Through Hole parts

Electronics Forum | Mon Mar 09 16:36:38 EST 1998 | Jim McLenaghan

| We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | 1) Do you need

Pasteprinter | unffilled Pads

Electronics Forum | Mon Oct 16 09:14:14 EDT 2023 | tommy_magyar

Is there only 1 pcba affected or more? Can try splitting the large apertures in 4. Check squeegee blades and paste quantity on stencil?

Re: BGA Repair Problems

Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis

| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple

solution to design challenge (ubga, NSMD pads, heavy traces)

Electronics Forum | Wed Mar 18 11:27:24 EDT 2020 | slthomas

I am about to order a stencil and I can already see that I'm going to have issues. I'm hoping someone has a recipe for this scenario that we haven't tried yet. The parts are 16 mil pitch bga's, the pads are NSMD (10 mil dia. with 12.6 mil mask open

Type 3 vs. Type 4 solder paste

Electronics Forum | Fri Nov 10 09:13:34 EST 2006 | russ

Dave hit the cons pretty well for type 4 type 4 is used when you have extremely small apertures and type 3 will not fit into them or release adequately basically. I have not yet had application that requires it but got very close once, .007 circle

Solder balls

Electronics Forum | Thu Jul 17 15:12:18 EDT 2008 | slthomas

To quote a regular here, "Are you sure your washer is set up correctly?" :P He's a WS junkie. This is a really common problem and is discussed here often. Mid chip solder balls (solder beads) are almost always the result of too much paste being dep

stepped stencils

Electronics Forum | Thu Feb 23 18:05:53 EST 2006 | kennyg

What are some general guidelines for the minimum proximity of apertures to a stepdown on a stepped stencil. I have a step from 7 mils to 5 (one mil step each on the top and bottom). How far does the step need to extend beyond the apertures on the

Re: Tombstoning of chip capacitors

Electronics Forum | Wed Aug 25 16:42:32 EDT 1999 | Dave

| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is

DEK 288 machine...

Electronics Forum | Thu Sep 20 09:12:28 EDT 2001 | jschake

If you were successful in running the machine in dry cycle mode, then I would expect with new squeegees that the prints would be acceptable. To give you more tangible data on what you may expect from the actual print results, maybe you could run the


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